Crack monitoring method based on Cu coating sensor and electrical potential technique for metal structure

Hou, Bo; He, Yuting; Cui, Ronghong; Gao, Chao; Zhang, Teng

doi:10.1016/j.cja.2015.02.016

Cited by 10 publications

(4 citation statements)

References 24 publications

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“…9 that there was no phenomenon of discontinuity or desquamation on the fractured Ti/TiN film sensor. This indicates that the Ti/TiN film sensor was integrated with the 2A12-T4 substrate firmly during the whole experiment and the Ti/TiN film sensor exhibited good damage consistency with the substrate, which is the precondition and basis of monitoring structural crack by this method [8]. Fig.…”

Section: Resultsmentioning

confidence: 77%

“…In recent years, the electrical potential method has been given a great deal of attention in the field of nondestructive testing and this may be due to its many advantages, particularly the fact that it is based on a simple principle. However, there are still certain issues in monitoring crack by using electrical potential technique directly [8]. Therefore, a new method, preparing conductive film sensors on the surface of substrate and measuring the changes in electrical information of sensor, was developed for monitoring crack damage.…”

Section: Introduction mentioning

confidence: 99%

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Preparation and Application of Film Sensor for Metal Structure Crack Monitoring

Hou¹,

He²,

Cui³

et al. 2015

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A crack monitoring technique is desired to ensure the safety and reliability of metallic structures. In the present study, a conductive film sensor was presented to monitor structural cracks in metal structures in real-time based on the electrical potential method. First, a Ti/TiN film sensor was prepared on the fatigue critical portion of a 2A12-T4 aluminum alloy specimen by vacuum ion plating technology, which allows firm integration with the metal surface. A finite element model (FEM) of the Ti/TiN film sensor was then constructed and the changes in the output of the sensor along with corresponding changes in crack propagation were discussed. The results indicated that the Ti/TiN film sensor has high sensitivity to cracks and it is feasible to monitor structural surface cracks using the sensor. Finally, crack monitoring experiments were carried out based on the Ti/TiN film sensor. Experimental results showed that the output potential curve of the Ti/TiN film sensor contained several regions, which corresponded to plastic deformation accumulation, crack propagation, and sensor failure, respectively. Therefore, the information on the origination and propagation of structural cracks can be gained through analyzing changes in slope of the output potential values of the Ti/TiN film sensor with respect to time.

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Section: Resultsmentioning

confidence: 77%

Section: Introduction mentioning

confidence: 99%

Preparation and Application of Film Sensor for Metal Structure Crack Monitoring

Hou¹,

He²,

Cui³

et al. 2015

Self Cite

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“…Therefore, the sensor can be utilized with a standard bridge acquisition unit instead of a strain gauge. A bridge is a more precise circuit for measuring small changes in resistance than more commonly used voltage dividers, as in [ 16 ]. Additionally, compensation for temperature and strain can be included.…”

Section: Discussionmentioning

confidence: 99%

“…Most of them are based on new capacitive and resistive sensors developed with materials such as allotropes of carbon (e.g., nanotubes, graphite, graphene) or metal micro/nanoparticles (e.g., silver, copper) in the form of pastes or inks ready for printing on the driving layer by various manufacturing methods. In [ 15 , 16 ], a water–ethanol base formulation with nanosized copper or pulsed bias arc ion Cu plating on a dielectric layer was applied on a specimen under a fatigue test. The change in the electric field of the conductive sensing layer was achieved as a fluctuation in the measured electrical potential value, due to crack initiation and propagation on the sensor coating induced by a structural crack.…”

Section: Introductionmentioning

confidence: 99%

The Experimental Verification of Direct-Write Silver Conductive Grid and ARIMA Time Series Analysis for Crack Propagation

Kurnyta

Baran

Kurnyta-Mazurek

et al. 2021

Sensors

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The paper presents experimental verification of customized resistive crack propagation sensors as an alternative method for other common structural health monitoring (SHM) techniques. Most of these are sensitive to changes in the sensor network configuration and a baseline dataset must be collected for the analysis of the structure condition. Sensors investigated within the paper are manufactured by the direct-write process with electrically conductive, silver-microparticle-filled paint to prepare a tailored measuring grid on an epoxy or polyurethane coating as a driving/insulating layer. This method is designed to enhance the functionality and usability compared to commercially available crack gauges. By using paint with conductive metal particles, the shape of the sensor measuring grid can be more easily adapted to the structure, while, in the previous approach, only a few grid-fixed sensors are available. A fatigue test on the compact tension (CT) specimen is presented and discussed to evaluate the ability of the developed sensors to detect and monitor fatigue cracks. Additionally, the ARIMA time series algorithm is developed both for monitoring and predicting crack growth, based on the acquired data. The proposed sensors’ verification reveal their good performance to detect and monitor fatigue fractures with a relatively low measurement error and ARIMA estimated crack length compared with the crack opening displacement (COD) gauge.

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Structural Integrity Control Technology Based on Structural Damage Monitoring

Zhang

et al. 2019

ICAF 2019 – Structural Integrity in the Age of Additive Manufacturing

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Crack monitoring method based on Cu coating sensor and electrical potential technique for metal structure

Cited by 10 publications

References 24 publications

Preparation and Application of Film Sensor for Metal Structure Crack Monitoring

Preparation and Application of Film Sensor for Metal Structure Crack Monitoring

The Experimental Verification of Direct-Write Silver Conductive Grid and ARIMA Time Series Analysis for Crack Propagation

Structural Integrity Control Technology Based on Structural Damage Monitoring

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