2013
DOI: 10.1088/0960-1317/23/12/125035
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Crack-free and reliable lithographical patterning methods on PDMS substrate

Abstract: Cracks commonly appear in metal patterns when fabricated on native poly(dimethylsiloxane) (PDMS) substrate using general micro-electro-mechanical systems (MEMS) fabrication processes such as lift-off and metal etching. This paper introduces simple, reliable and reproducible fabrication methods to realize crack-free metal patterns on PDMS using intermediate-parylene-deposited PDMS substrate and parylene-filled PDMS substrate. The fabrication parameters of crack-free metal patterning were optimized resulting in … Show more

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Cited by 35 publications
(32 citation statements)
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References 21 publications
(27 reference statements)
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“…Dozens of methods have been developed to avoid cracking during drying. Those methods are mostly achieved in four ways: (i) enhancing the strength of the body, (ii) releasing or reducing the capillary stress, (iii) avoiding the substrate constraint, and (iv) combining at least two ways mentioned above . Some methods are usually accomplished by adding polymeric binders, surfactants or soft particles into the suspensions.…”
Section: Introductionmentioning
confidence: 99%
“…Dozens of methods have been developed to avoid cracking during drying. Those methods are mostly achieved in four ways: (i) enhancing the strength of the body, (ii) releasing or reducing the capillary stress, (iii) avoiding the substrate constraint, and (iv) combining at least two ways mentioned above . Some methods are usually accomplished by adding polymeric binders, surfactants or soft particles into the suspensions.…”
Section: Introductionmentioning
confidence: 99%
“…Next, parylene in a thickness of 400 nm was deposited on the PDMS substrate using low-pressure chemical vapor deposition (LPCVD) (PDS 2010, Specialty Coating Systems, Indianapolis, IN, USA). Then, parylene on PDMS was etched using O 2 plasma 50 W for 5 min so that the majority of parylene on the PDMS surface was removed and only a small portion of parylene remained in the porous structures of PDMS [15,17]. Lastly, after separation of pc-PDMS from the silicon wafer, it was annealed for 2 h at 200 °C in a vacuum oven (OV-11, JEIOTECH, Seoul, Korea).…”
Section: Methodsmentioning
confidence: 99%
“…As PDMS has a porous surface structure, it exhibits properties such as high gas permeability and high water absorption [14,16,17,18,19]. Pc-PDMS can be formed as the particles of parylene in a gaseous state are trapped only in the porous structure of the PDMS surface after etching the majority of the parylene deposited conformally on the PDMS surface [17]. Pc-PDMS is proved to preserve the inherent beneficial mechanical properties of PDMS, such as elasticity and flexibility, and to lower the water absorption better than native PDMS [15].…”
Section: Introductionmentioning
confidence: 99%
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“…1(a)). 25 A positive photoresist (AZ9260, MicroChemicals, Ulm, Germany) in a thickness of 10 lm was patterned to create the electrode traces and pads. Then, the developed photoresist pattern was reflowed at 130 C for 90 s on a hotplate.…”
mentioning
confidence: 99%