Cover Image, Volume 67, Issue 5

Jeong, Keuk-Min; Yoo, Dae‐Geon; Lee, Nam-Kyoung; Lee, Hyeok-Gi; Ando, Shinji; Ha, Chang‐Sik

doi:10.1002/pi.5598

Cited by 1 publication

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“…24,25 Large amount of research have been done on preparing GO/PI films with high performance properties. [25][26][27][28] Significant efforts have been reported to indicate that the thermal conductive property of PI is affected by the interface and the interfacial thermal resistance between fillers and polymer matrix. 29 However, the effect of single filler on the increase of the material was always limited.…”

Section: Introductionmentioning

confidence: 99%

Synergistic effects of boron nitride sheets and reduced graphene oxide on reinforcing the thermal conduction, SERS performance and thermal property of polyimide composite films

Zhao

Wang

et al. 2022

J of Applied Polymer Sci

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Polyimide (PI) composite films with hybrid fillers containing hBN (hexagonal boron nitride) sheets and rGO (reduced graphene oxide) were successfully fabricated by in‐situ polymerization. Herein, hBN sheets and rGO were obtained by ball milling and chemical reduction, respectively. In PI composite films, hBN can be tightly attached onto the surface of rGO via π‐π interaction, which can benefit the construction of heat‐conduction pathways and reduce boundary of heat resistance. The results show that the addition of rGO and hBN could enhance the thermal conductivity by synergistic effects. Specially, hBN and rGO are at the weight ratio of 1:1 and at the total loading of 33 wt%, thermal conductivity of PI composites can reach up to 1.19 Wm−1 K−1, which is 5.61 times higher than that of pure PI. Thermal property and dynamic mechanical property of composite films were also investigated. Besides, compared with pure PI, mixed fillers have obvious surface‐enhanced Raman scattering signals, indicating the synergistic effect of the mixed fillers. Overall, this study gives insights into heat dissipative and high sensitivity analysis components which may be used in the field of high‐temperature micro fabrication.

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