Covalently introducing amino-functionalized nanodiamond into waterborne polyurethane via in situ polymerization: Enhanced thermal conductivity and excellent electrical insulation

Nan, Bingfei; Xiao, Luqi; Wu, Kun; Xu, Chaochao; Zhang, Ending; Zheng, Haoting; Zhan, Yingjie; Zhang, Qiang; Shi, Jun; Lu, Mangeng

doi:10.1016/j.colsurfa.2020.124752

Cited by 27 publications

(7 citation statements)

References 54 publications

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“…The thermal resistance index ( T HRI ) is used as an indicator to evaluate the heat resistance of materials, with higher T HRI values indicating better thermal stability . The equation for calculating the value of the heat resistance index is T HRI = 0.49 × [ T 5% + 0.6 × ( T 30% – T 5% )], which corresponds to temperatures of T 5% and T 30% for mass loss at 5 and 30%, respectively. The T HRI values for WTA-0, WTA-1, WTA-2, WTA-3, and WTA-4 are 152.64, 152.46, 154.35, 154.59, and 155.82 °C, respectively.…”

Section: Resultsmentioning

confidence: 99%

Tough and Self-Healing Waterborne Polyurethane Elastomers via Dynamic Hydrogen Bonds Design for Flexible Conductive Substrate Applications

Song,

Li,

Song

et al. 2024

ACS Appl. Mater. Interfaces

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Balancing the mechanical strength and self-healing performance of polyurethane (PU) remains a significant challenge in achieving excellent self-repairing PU materials. In this study, a self-healing waterborne PU elastomer was designed from a bionic concept by incorporating 2′-deoxythymidine (2′-dT) and isophorone diamine (IPDA) into the polymer chain. The loose stacking of IPDA’s irregular cycloaliphatic structure resulted in the irregular arrangement of urethane bonds in the hard domain. The formation of sextuple hydrogen bonds between 2′-dT and urethane bonds, as well as quadruple hydrogen bonds between urethane bonds themselves, enhanced the mechanical properties of the material. The multiple hydrogen bonds can dissociate, recombine, and dissipate energy, thereby improving the material’s repair capability. The hierarchical self-assembly of hydrogen bonds enabled the PU to achieve a tensile strength of 15.3 MPa and toughness of 100.75 MJ/m3. The prepared PU film is highly transparent and has a transmittance of more than 90%. Additionally, it can undergo rapid repair under high temperatures or under trace solvent conditions. When used as a flexible conductive substrate, it quickly restored the conductivity and enhanced the material’s lifespan after surface damage. This environmentally friendly and self-healing waterborne PU elastomer will hold broad application prospects in the field of flexible electronic devices.

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Section: Resultsmentioning

confidence: 99%

Tough and Self-Healing Waterborne Polyurethane Elastomers via Dynamic Hydrogen Bonds Design for Flexible Conductive Substrate Applications

Song,

Li,

Song

et al. 2024

ACS Appl. Mater. Interfaces

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“…The thermal stability of the composite samples was investigated by thermogravimetric (TG) analysis, and the corresponding results are shown in Figure a,b. Both WPU/Pn@PWO and WPU/Pn@PWO@SiO 2 composites show three distinct decomposition processes, which correspond to the decomposition of the paraffin, hard segments, and soft segments of WPU, respectively. , The thermal stability of phase change composites depends mainly on the thermal stability of paraffin rather than the WPU matrix. The composites are depolymerized at 10% weight loss temperatures ( T 10% ), which is also known as a criterion for thermal stability .…”

Section: Resultsmentioning

confidence: 99%

Flexible and Mechanically Enhanced Polyurethane Composite for γ-ray Shielding and Thermal Regulation

Cai

et al. 2023

ACS Appl. Mater. Interfaces

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Microencapsulation of paraffin with lead tungstate shell (Pn@PWO) shows the drawbacks of low wettability and poor leakage-proof property and thermal reliability, restricting the application of phase change microcapsules. Herein, a novel paraffin@lead tungstate@silicon dioxide double-shelled microcapsule (Pn@PWO@SiO 2 ) has been successfully constructed by the emulsion-templated interfacial polycondensation and applied in the waterborne polyurethane (WPU). The results indicated that a SiO 2 layer with controlled thickness was formed on the PbWO 4 shell. The Pn@PWO@SiO 2 microcapsules have exhibited superior leakage-proof properties and thermal reliability through doubleshelled protection, and the leakage rate decreased by at least 54.11% compared to that of Pn@PWO microcapsules. The SiO 2 layer with abundant polar groups ameliorated the wettability of microcapsules and the interfacial compatibility between microcapsules and the WPU matrix. The tensile strength of WPU/Pn@ PWO@SiO 2 -2 composites reached 10.98 MPa, which was over 7 times greater than that of WPU/Pn@PWO composites. In addition, WPU/Pn@PWO@SiO 2 -2 composites with a latent heat capacity of over 41 J/g exhibited efficient phase change stability and γ-ray shielding properties. Also, the mass attenuation coefficients reached 1.38 cm 2 /g at 105.3 keV and 1.12 cm 2 /g at 86.5 keV, respectively. These properties will greatly promote the application of WPU/Pn@PWO@SiO 2 composites into γ-ray-shielding devices with thermal regulation.

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“…The covalently bonded BN/RGO and 3D network played a huge role in reducing the thermal resistance of the filler/filler and filler/matrix interfaces. Nan et al [72] used hydrogen peroxide solution to oxidize nano diamond (ND) particles, and then covalently functionalized the oxidized ND particles via hydrothermal reaction in the presence of ethylenediamine. Amino-functionalized ND fillers were covalently incorporated into isocyanate-terminated polyurethane prepolymer chains via in situ polymerization.…”

Section: Covalent Bond Modificationmentioning

confidence: 99%

Development and Challenges of Thermal Interface Materials: A Review

Yuan

Hussien

et al. 2021

Macro Materials & Eng

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With the development of electronic equipment components in the direction of integration, miniaturization, and intelligence, their increasingly high heat dissipation requirements pose a high challenge to the thermal conductivity (TC) of thermal interface materials (TIMs). Polymer-based composite materials with high TC have gradually been favored because of their good processing performance, low cost, and low density. It is important to summarize the relationship between the problems of low heat conduction and their solutions in relation to polymer-based composite materials. For this purpose, this review comprehensively discusses the basic mechanisms of heat transfer inside polymer-based TIMs, the current challenges, and future prospects for improving TC. Strategies involving surface modification and network construction can reduce interfacial thermal resistance and enhance heat conduction.

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Covalently introducing amino-functionalized nanodiamond into waterborne polyurethane via in situ polymerization: Enhanced thermal conductivity and excellent electrical insulation

Cited by 27 publications

References 54 publications

Tough and Self-Healing Waterborne Polyurethane Elastomers via Dynamic Hydrogen Bonds Design for Flexible Conductive Substrate Applications

Tough and Self-Healing Waterborne Polyurethane Elastomers via Dynamic Hydrogen Bonds Design for Flexible Conductive Substrate Applications

Flexible and Mechanically Enhanced Polyurethane Composite for γ-ray Shielding and Thermal Regulation

Development and Challenges of Thermal Interface Materials: A Review

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