Coupling of Energy Into PCB Traces in a Reverberant Environment: Absorption Cross-section and Probability of Susceptibility

Venkateshaiah, Arunkumar H.; Xie, Huimin; Dawson, J.F.; Marvin, A.C.; Dawson, Linda; Robinson, M.P.

doi:10.1109/emceurope48519.2020.9245804

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B Influence Of Cross Coupling Between Pins1

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2021

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“…The models are illuminated with 64 individual plane waves chosen based on the Gauss-Legendre Quadrature method [8], [17] and our previous work [18] to achieve optimum results with the minimum number of simulations. It takes less time and less computer memory to calculate the simplified model than the full package model.…”

Section: B Influence Of Cross Coupling Between Pinsmentioning

confidence: 99%

Analysis and Estimation of Electromagnetic Energy Coupled into IC packages

Tang

Venkateshaiah

Dawson

et al. 2021

2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium

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Interference analysis and prediction in integrated circuits (ICs) is of significant interest to the Electromagnetic Compatibility (EMC) community. In this paper, an easy method is introduced to estimate the level of RF interference coupled into ICs through the package. Although IC packages are in different forms with large number of pins, the presented analysis method provides a general solution and greatly shortens the computation time by creating a simplified model with consideration of the cross coupling between pins. The expected voltage range at the outer ends and inner ends of the pins are also investigated for resistive loads. The levels of energy coupled into PCB traces and packages are also compared for immunity analysis.

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Section: B Influence Of Cross Coupling Between Pinsmentioning

confidence: 99%