2024 25th International Conference on Electronic Packaging Technology (ICEPT) 2024
DOI: 10.1109/icept63120.2024.10668627
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Coupling Characteristics of BGA Solder Balls at High Frequencies: A Simulation Study on Electromagnetic-Thermal-Mechanical Interactions Considering Skin and Proximity Effects

Chulin Wang,
Pan Ren,
Xiaokang Li
et al.
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