Abstract--Three-dimensional (3D) interconnects built upon multiple layers of polyimide are required for constructing 3D circuits On CMOS (low r esistivity) Si wafers, GaAs, and cera mic substrates. Thin film micros trip lines (TFMS) with finite width ground planes embedded in the polyimide are often used. However, the closely spaced TFMS lines are susceptible to high levels of coupI.ing, which degrades circuit performance. In this paper, Finite Difference T ime Domain (FDTD) analys is and experimental measurements are used to show that the ground planes must be connected by via holes to r ed uce coupling in both the forward and backward directions.Furthermore, it is shown that coupled micros trip lines establish a slotline type mode between the two gro und planes and a dielectric waveguide type mode, and that the via holes recommended her e eliminate these two modes.