Coupled Thermal-Stress Analysis for FC-BGA Packaging Reliability Design

Hirohata, Kenji; Hisano, Katsumi; Mukai, Minoru; Aoki, Hideo; Takubo, C.; Kawakami, Takashi; Pecht, Michael

doi:10.1109/tcapt.2009.2037215

Cited by 21 publications

(4 citation statements)

References 7 publications

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“…To quantitatively evaluate the effects of design factors on the response variables, analysis of variance can be performed by combining computer-aided engineering and design of experiments (DOE). 30) When approximating the response surface for the SSF expansion rate, the number of simulations becomes large and computationally intensive because of the nonlinear behavior of SSF expansion. Use of DOE makes it possible to minimize the number of numerical experiments required for understanding the effects of various factors on the response of the structure.…”

Section: Response Surfaces For Ssf Expansion Ratementioning

confidence: 99%

“…The heat transfer coefficient of the grease was set so that the contact thermal resistance between the plate and the heat sink was 1.5 × 10 −5 m 2 •K W −1 , which is the value for a contact pressure of 2.5 MPa reported in Ref. 30. The electrical conductivity of the SiC chip was calculated from the resistance value of 100 A cm −2 at 383 K reported previously.…”

Section: Demonstration Module Under Heating and Cooling Processmentioning

confidence: 99%

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Combined FEM and phase field method for reliability design of forward degradation in SiC bipolar device

Kano,

Hirohata,

Kato

et al. 2023

Jpn. J. Appl. Phys.

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The reliability of 4H-SiC bipolar devices is compromised by the expansion of single Shockley stacking faults (SSFs) during forward-current operation. Because SSF expansion is governed by multiphysical aspects, including electrical, thermal, and stress states, analysis of the mounted structure is important for improving power module design. We propose a practical design method that analyzes the critical condition due to SSF expansion using a combined method with a multiphysical finite element method (FEM) and phase field (PF) model based on the time-dependent Ginzburg-Landau (GL) equation. In preliminary studies, the thermal deformation of the demonstration module and the variation of threshold current of a bar-shaped SSF were verified from experimental and reference data. Estimating the SSF expansion rate on the constructed response surface under the mutiphysical inputs from FEM, the proposed design method can be used effectively in the design process by changing the various design variables.

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Section: Response Surfaces For Ssf Expansion Ratementioning

confidence: 99%

Section: Demonstration Module Under Heating and Cooling Processmentioning

confidence: 99%

Combined FEM and phase field method for reliability design of forward degradation in SiC bipolar device

Kano,

Hirohata,

Kato

et al. 2023

Jpn. J. Appl. Phys.

Self Cite

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“…Recently, efforts have been made to develop some new methods [21]- [24] aimed at thermal fatigue reliability analysis and design of high-density packages. Zeng et al [21] optimized the materials of the solder composition by taking into account the influence of metals dissolved from the soldering pad and under bump metallization (UBM).…”

Section: Introductionmentioning

confidence: 99%

“…The study builds a basis for design and reliability evaluation of BGA packages. Hirohata et al [24] proposed a reliability prediction method for thermal fatigue failure of solder bumps based on coupled thermal-stress analysis and statistical and probabilistic methods in order to select a suitable packaging solution at an early stage of design.…”

Section: Introductionmentioning

confidence: 99%

Thermal Fatigue Reliability Analysis and Structural Optimization Based on a Robust Method for Microelectronics FBGA Packages

Huang

Pecht

2015

IEEE Trans. Device Mater. Relib.

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In this paper, we propose a mixed robust method based on three-level and second-order experiment design, the quadric surface, and finite-element analysis to analyze and optimize thermal fatigue reliability of an FBGA package. According to structural characteristics of FBGA packages, six design variables are selected as optimized objects. The equivalent thermal fatigue strain of solder joints of FBGA packages is used as an objective function of thermal fatigue reliability optimization design. Threelevel and second-order experiment design was carried out for six design variables, and the equivalent thermal strain of solder joints was calculated by finite-element analysis according to experiment design. Then a quadric surface model of six design variables and the equivalent thermal strain of solder joints was built, and variance analysis and accuracy verification were performed. From the model and significance analysis, the nonlinear relation between design variables and thermal strain of solder joints, and the interaction among design parameters were obtained. Finally, a thermal fatigue robust optimization model was built, and optimum structural parameters and equivalent thermal fatigue strain of solder joints were obtained. Equivalent thermal fatigue strain decreased from 0.01858200 to 0.00951976 and was reduced by 48.77%, as shown by comparing the thermal strains before and after optimization.Index Terms-FBGA package, three-level and second-order experiment design, quadric surface, thermal fatigue reliability, robust optimization design.

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Function reconsideration of indium bump in InSb IRFPAs

Meng

Lü

2019

Opt Quant Electron

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Coupled Thermal-Stress Analysis for FC-BGA Packaging Reliability Design

Cited by 21 publications

References 7 publications

Combined FEM and phase field method for reliability design of forward degradation in SiC bipolar device

Combined FEM and phase field method for reliability design of forward degradation in SiC bipolar device

Thermal Fatigue Reliability Analysis and Structural Optimization Based on a Robust Method for Microelectronics FBGA Packages

Function reconsideration of indium bump in InSb IRFPAs

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