Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction

Hassan, Sheikh; Rajaguru, Pushparajah; Stoyanov, Stoyan; Bailey, Christopher; Tilford, Timothy

doi:10.1016/j.pedc.2024.100063

Power Electronic Devices and Components

2024

DOI: 10.1016/j.pedc.2024.100063

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Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction

Sheikh Hassan,

Pushparajah Rajaguru,

Stoyan Stoyanov

et al.

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Cited by 1 publication

References 27 publications

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Reduced-Order Modelling for Coupled Thermal-Mechanical Analysis and Reliability Assessment of Power Electronic Modules with Nonlinear Material Behaviours

Hassan,

Stoyanov,

Rajaguru

et al. 2024

2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)

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Reduced-Order Modelling for Coupled Thermal-Mechanical Analysis and Reliability Assessment of Power Electronic Modules with Nonlinear Material Behaviours

Hassan,

Stoyanov,

Rajaguru

et al. 2024

2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)

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Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction

Cited by 1 publication

References 27 publications

Reduced-Order Modelling for Coupled Thermal-Mechanical Analysis and Reliability Assessment of Power Electronic Modules with Nonlinear Material Behaviours

Reduced-Order Modelling for Coupled Thermal-Mechanical Analysis and Reliability Assessment of Power Electronic Modules with Nonlinear Material Behaviours

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