Coupled equivalent circuit models for fluid flow and heat transfer in large connected microchannel networks – The case of oblique fin heat exchangers

Mou, Nasi; Lee, Poh Seng; Khan, Saif A.

doi:10.1016/j.ijheatmasstransfer.2016.06.069

Cited by 8 publications

(2 citation statements)

References 24 publications

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“…By using this analogy, it is possible to draw the equivalent electric circuit for a given array of particles, where the volumetric flow rate, Q, becomes the currents, the hydraulic resistances, R hyd , in each channel becomes the resistors and pumps providing the pressure differences, Δp, becomes voltage sources (or current sources) [19].…”

Section: Network Topology and Geometrymentioning

confidence: 99%

Numerical simulation and circuit network modelling of flow distributions in 2-D array configurations

Wang

Yang

et al. 2018

THERM SCI

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Packing configuration is widely used in chemical industries such as chemical reaction and chromatograph where the flow distribution has a significant effect on the performance of heat and mass transfer. In the present paper, numerical simulation is carried out to investigate the fluid-flow in three 2-D array configurations including in-line array, staggered array and hexagonal array. Meanwhile, a simplified equivalent circuit network model based on the Voronoi tessellation is proposed to simulate the flow models. It is found that firstly, the local Reynolds number could be used as a criterion to determine the flow regime. Flow with maximum local Reynolds number less than 40 could be regarded as Darcy flow. Secondly, the flow pattern can be well represented by the network model in the range of Darcy flow with the determination method of hydraulic resistance proposed in the present paper.

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Section: Network Topology and Geometrymentioning

confidence: 99%

Numerical simulation and circuit network modelling of flow distributions in 2-D array configurations

Wang

Yang

et al. 2018

THERM SCI

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“…Their study also indicated that better performance can be achieved by having smaller oblique angles and smaller fin pitches. Mou et al [8] adopted an equivalent circuit model to study the mass flow and temperature distribution in oblique fin heat exchangers. The developed model offers the capability to predict the mass flow and temperature distribution for different parameters with good accuracy.…”

Section: Introductionmentioning

confidence: 99%

Entropy Generation and Heat Transfer Performance in Microchannel Cooling

Kurnia

Lim

Chen

et al. 2019

Entropy

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Owing to its relatively high heat transfer performance and simple configurations, liquid cooling remains the preferred choice for electronic cooling and other applications. In this cooling approach, channel design plays an important role in dictating the cooling performance of the heat sink. Most cooling channel studies evaluate the performance in view of the first thermodynamics aspect. This study is conducted to investigate flow behaviour and heat transfer performance of an incompressible fluid in a cooling channel with oblique fins with regards to first law and second law of thermodynamics. The effect of oblique fin angle and inlet Reynolds number are investigated. In addition, the performance of the cooling channels for different heat fluxes is evaluated. The results indicate that the oblique fin channel with 20° angle yields the highest figure of merit, especially at higher Re (250–1000). The entropy generation is found to be lowest for an oblique fin channel with 90° angle, which is about twice than that of a conventional parallel channel. Increasing Re decreases the entropy generation, while increasing heat flux increases the entropy generation.

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Optimization study on the uniform temperature of an additively manufactured cooler for a semiconductor heating device

Lee

Kim

et al. 2023

Applied Thermal Engineering

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Coupled equivalent circuit models for fluid flow and heat transfer in large connected microchannel networks – The case of oblique fin heat exchangers

Cited by 8 publications

References 24 publications

Numerical simulation and circuit network modelling of flow distributions in 2-D array configurations

Numerical simulation and circuit network modelling of flow distributions in 2-D array configurations

Entropy Generation and Heat Transfer Performance in Microchannel Cooling

Optimization study on the uniform temperature of an additively manufactured cooler for a semiconductor heating device

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