1995
DOI: 10.1016/0307-904x(94)00019-3
|View full text |Cite
|
Sign up to set email alerts
|

Coupled diffusion and stress by the finite element method

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1

Citation Types

0
7
0

Year Published

2009
2009
2023
2023

Publication Types

Select...
4
2

Relationship

0
6

Authors

Journals

citations
Cited by 13 publications
(7 citation statements)
references
References 5 publications
0
7
0
Order By: Relevance
“…It would be of great interest to extend the proposed model to consider solid deformation (e.g., thermal expansion, hygroscopic swelling, and vapor pressure‐induced void growth). Coupling of conventional diffusion models with stress analysis has been studied in the literature . Similar approaches can be applied to the convection–diffusion model, except that vapor pressure must be included in the calculation of solid deformation.…”
Section: Discussionmentioning
confidence: 99%
See 1 more Smart Citation
“…It would be of great interest to extend the proposed model to consider solid deformation (e.g., thermal expansion, hygroscopic swelling, and vapor pressure‐induced void growth). Coupling of conventional diffusion models with stress analysis has been studied in the literature . Similar approaches can be applied to the convection–diffusion model, except that vapor pressure must be included in the calculation of solid deformation.…”
Section: Discussionmentioning
confidence: 99%
“…Coupling of conventional diffusion models with stress analysis has been studied in the literature. 17,[76][77][78][79] Similar approaches can be applied to the convection-diffusion model, except that vapor pressure must be included in the calculation of solid deformation. Vapor pressure is crucial because it could result in large deformation and instability of soft thin films.…”
Section: Discussionmentioning
confidence: 99%
“…To date, a body of models tentatively describes the existence of strong couplings between mechanical, thermal and diffusive phenomena occurring in polymeric materials in fluid transport, with the additional difficulty in modeling the state of the fluid within the polymer. Theoretical descriptions of these coupling phenomena are based on empirical or thermodynamic interpretations, as given in the selected open literature [25][26][27][28][29][30][31][32][33][34][35][36][37].…”
Section: ¼ àDrc ð1þmentioning
confidence: 99%
“…Indeed the coupling between deformation and diffusion plays an important role also in many other applications and technological processes, such as metal forming, integrated circuit fabrication (doping of semi-conductors), curing of certain ceramics, etc. (see for example [6][7][8]). Often, in these applications, the complete two-way interaction between the diffusing species and the solid into which it diffuses is neglected.…”
mentioning
confidence: 99%
“…Often, in these applications, the complete two-way interaction between the diffusing species and the solid into which it diffuses is neglected. The mechanical equations of equilibrium, together with the equations of elasticity and compatibility of the solid matrix, are solved to determine the stress distribution, which, in turn, is used in the diffusion equations, formulated in terms of concentration and stress [7,8], or, on the contrary, Fick's law based on a constant diffusivity is employed to derive the concentration field, which is then introduced in the mechanical equations as an initial strain [5]. In the first case, the diffusion equations are coupled to stress, but the effect of concentration variation on the mechanical response is not included, while, in the second case, the mechanical equations are coupled to concentration, but the effect of stress on the diffusive process is not included.…”
mentioning
confidence: 99%