Cost effective maskless lithography: Direct UV laser writing of microstructures for microfluidics applications

Ziauddin, Mohammed; Mourad, Abdel‐Hamid I.; Khashan, Saud

doi:10.1109/icaset.2018.8376878

Cited by 4 publications

(5 citation statements)

References 9 publications

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“…Other lithography techniques such as reactive-ion etching, electron-beam lithography, wet etching, multiphoton lithography, direct laser writing, focused ion beam, and stereolithography have also been used to fabricate the master moulds. 44–48 These methods allow for high-resolution fabrication and some do not require masks ( e.g. direct laser writing, electron-beam, and focused-ion beam all of which are controlled by a software instead of a physical mask) which can potentially reduce the costs.…”

Section: Fabricationmentioning

confidence: 99%

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Conventional and emerging strategies for the fabrication and functionalization of PDMS-based microfluidic devices

2021

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Section: Fabricationmentioning

confidence: 99%

“…Nevertheless, they are usually low-speed restricting the path to commercialization. 48,49 For example, two photon polymerization as a promising stereolithography approach allows for fabrication of master moulds with extremely high resolution. 50 However, it takes around 3.5 h to fabricate a 25 000 μm 3 cube using this technique.…”

Section: Fabricationmentioning

confidence: 99%

Conventional and emerging strategies for the fabrication and functionalization of PDMS-based microfluidic devices

2021

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“…DLL technique was implemented, as well, for manufacturing nanostructures for Photonics [20]. By removing the need for masks, this technique reduced fabrication efforts [21]. Henceforth, many designs were incorporated with flexibility to produce more complex 3D microstructures [22].…”

Section: Direct Laser Lithographymentioning

confidence: 99%

Studying the impact of depth of focus on 3D profile of negative photoresist material: a simulation approach

et al. 2020

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For quality patterning of microstructures, it is essential that all process parameters are optimized to ensure well-developed 3D profile of the resist. Advances in direct laser lithography have provided maskless and rapid prototyping methods of manufacturing microstructures. Among all other process parameters, the quality of the patterned structure is critically affected by the depth of focus adjustments of the laser spot. In this study, a simulation approach is adopted and the LAB Module of GenISys lithography simulation software is implemented to determine the optimum depth of focus for negative photoresist material. Modeling and studying straight-line structure at different focusing depths at constant exposure dosages is carried out in this work. At the constant dosage of 45 mJ/cm 2 , the 15 µm depth of focus yields the best quality for the 3D resist profile.

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“…Direct laser writing (DLW) is a versatile laser-based technique utilized for direct inscription of various materials with various suitable lasers [3][4][5][6] in order to create diffractive wave guiding or ablated two-dimensional (2D) or three-dimensional (3D) microstructures 7,8 . The procedure involves directing a focused laser beam onto the surface or within the bulk volume of a transparent photosensitive material to induce precise alterations in the material's properties.…”

Section: Introductionmentioning

confidence: 99%

Sub-diffraction limited direct diode laser patterning of methacrylic polymer thin films doped with silver nanoparticles

Sinani,

Karachousos-Spiliotakopoulos,

Tangoulis

et al. 2024

Laser-Based Micro- And Nanoprocessing XVIII

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High quality poly(methyl methacrylate) (PMMA) thin nanocomposite films doped with different concentration of silver (Ag) nanoparticles are demonstrated. SEM and TEM confirmed the presence of Ag-PMMA nanocomposites with excellent dispersion of Ag nanoparticles into the PMMA matrix and nanoparticles with an average size of 9 nm. By using a direct Laser writing system with a continuous wave 405 nm diode Laser source the films were exposed, allowing the formation of hole-like or linear patterns in the sub 200nm regime, using a 280nm FWHM sized laser spot, demonstrating, for the first time, the potential for sub-diffraction limit laser processing in such 2-material composite systems.

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Cost effective maskless lithography: Direct UV laser writing of microstructures for microfluidics applications

Cited by 4 publications

References 9 publications

Conventional and emerging strategies for the fabrication and functionalization of PDMS-based microfluidic devices

Conventional and emerging strategies for the fabrication and functionalization of PDMS-based microfluidic devices

Studying the impact of depth of focus on 3D profile of negative photoresist material: a simulation approach

Sub-diffraction limited direct diode laser patterning of methacrylic polymer thin films doped with silver nanoparticles

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