Cost and production analysis for substrates with embedded passives

Abstract

With the advent of new materials and technologies that enable passive components to be embedded within electronic substrates, one key question that arises is: under what circumstances (and for what type of applications) is it economically viable to consider using embedded passives? The economic issues that must be considered consist of a combination of manufacturing costs and throughputs, and non-manufacturing life cycle costs. This paper discusses the assessment of manufacturing costs associated with embedding resistors and capacitors in printed circuit boards and provides cost modeling results for an avionics board. The discussion is extended to include optimizing the specific embedded passive content in a board and design for production modeling when embedded passives are present. Life cycle cost issues are also qualitatively discussed.

Design considerations for thin‐film embedded resistor and capacitor technologies

“…Many cost models for embedded passives have been reported in the literature with varying degrees of complexity (Palesko, 2003;Sandborn et al, 2003;Snogren, 2003).…”

“…The following are some potential cost benefits of embedded technology:reduced SMT component cost;reduced SMT assembly cost;reduced parts count and inventory costs;more boards/panel with reduced board area;reduced layer count from less routing; andimproved assembly yield with fewer solder joints.Some cost benefits can be easily quantified (1 and 2) but many benefits are not easily quantifiable in a generic sense (3‐6) and require cost modeling on a case‐by‐case basis to determine the cost effectiveness of embedded technology for that application. Many cost models for embedded passives have been reported in the literature with varying degrees of complexity (Palesko, 2003; Sandborn et al , 2003; Snogren, 2003).…”

Highly Conductive 3D Printable Materials for 3D Structural Electronics

“…In addition to the production of PCBs, 3D printing allows for the formation of structural and embedded electronic systems, which can result in further material saving. 13 The use of embedded passive components, such as resistors, capacitors, and inductors, allows for multilayer circuits, thus reducing the footprint of a circuit. Some examples include fully customized lights, microwave electronics, and fully interactive and lightweight devices.…”

“…Because 3D printing allows for the selective placement of conductive material, it would eliminate the waste and the associated costs of safe disposal. In addition to the production of PCBs, 3D printing allows for the formation of structural and embedded electronic systems, which can result in further material saving . The use of embedded passive components, such as resistors, capacitors, and inductors, allows for multilayer circuits, thus reducing the footprint of a circuit.…”