2018
DOI: 10.1364/boe.9.004818
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Cortical bone quality affectations and their strength impact analysis using holographic interferometry

Abstract: It is now accepted that bone strength is a complex property determined mainly by three factors: quantity, quality and turnover of the bone itself. Most of the patients who experience fractures due to fragility could never develop affectations related to bone mass density (i.e. osteoporosis). In this work, the effect of secondary bone strength affectations are analyzed by simulating the degradation of one or more principal components (organic and inorganic) while they are inspected with a nondestructive optical… Show more

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Cited by 27 publications
(4 citation statements)
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“…The proposed method may be useful in other areas of interferometric measurements, specifically for biological applications [6,7] and coherence tomography [8,9]. In shearing interferometry, optimization of the reference element parameters can help to perform quantitative linear phase retardance [10][11][12].…”
Section: Introductionmentioning
confidence: 99%
“…The proposed method may be useful in other areas of interferometric measurements, specifically for biological applications [6,7] and coherence tomography [8,9]. In shearing interferometry, optimization of the reference element parameters can help to perform quantitative linear phase retardance [10][11][12].…”
Section: Introductionmentioning
confidence: 99%
“…In the interferometric field, holography is applied as an extension of the classic techniques, enabling a non-contact, non-invasive analysis of test samples. Also in this case several application can be found, such as cortical bone compression and load tests [6], in which the digital hologram interferometric acquisitions of different bone groups have been exploited for comparison purpose, or the study of wood deformation and strain distribution caused by humidity variations [7].…”
Section: Introductionmentioning
confidence: 99%
“…The DSCM is suited for samples with a planar surface and not any curved surface, which will cause a significant error or measurement deviation [21,22]. DSPI, originally called as electronic speckle pattern interferometry (ESPI) [23,24], is considered as the most reliable technique for measuring microscopic deformation and strain [25,26,27,28,29,30,31], and many scholars have applied the DSPI technology to measure the strain in many fields [32,33,34].…”
Section: Introductionmentioning
confidence: 99%