Abstract:Corrosion of electronic components can produce a wide range of failure signatures, from intermittent electrical faults to complete functional breakdown. This paper presents an investigation on the exposure of a simple connector-coating system. The system consists of a copper contact coated with a nickel layer underneath a gold finish layer. The system was characterized using the following techniques: optical microscopy, atomic force microscopy ͑AFM͒, scanning electron microscopy ͑SEM͒, energy dispersive X-ray … Show more
“…This is consistent with the porosity corrosion mechanism operating for medium-phosphorus ENIG, whereby the corrosion product, copper sulfide, creeps out of the pores in the ENIG layer and migrates onto the adjacent surface. 10,11,20 The corrosion products were confirmed by EDS to be predominately copper and sulfur for both ENIG surface finishes (Figs. 3b and 4b).…”
“…This is consistent with the porosity corrosion mechanism operating for medium-phosphorus ENIG, whereby the corrosion product, copper sulfide, creeps out of the pores in the ENIG layer and migrates onto the adjacent surface. 10,11,20 The corrosion products were confirmed by EDS to be predominately copper and sulfur for both ENIG surface finishes (Figs. 3b and 4b).…”
“…The chlorine attacked the submicrometer defects in the Au layer. These defects opened and led to the subsequent corrosion of theNi andCu alloysubstrate layer [30] (as seen in Fig. 41.1).…”
Section: D3 Enig and Enepig Surface Finishmentioning
“…Despite all the efforts to understand the corrosion rates and the formation of the different corrosion layers [23] and the effect of the environment on those materials (particularly for electronic applications [24]), very little has been done to take into consideration environmental data from developing countries to develop more realistic accelerated atmospheric corrosion tests (AACTs) that will mimic the environments typically found in developing countries. This subject will be discussed in more detail in the next section.…”
Section: Corrosion Of Electronic Equipment Worldwidementioning
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