1993
DOI: 10.1080/08927019309386249
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Corrosion product layers and biofouling interactions on 70/30 cupronickel in polluted chloride media

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Cited by 5 publications
(3 citation statements)
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“…Copper and their alloys present a lower formation of biological deposits (biofouling) due to, probably, toxic characteristics of the Cu ions (II) coming from the metal dissolution 10,11 . Thus, when the substrate is toxic for the microorganisms, a greater production of EPM than on no toxic samples, such as gold, was observed ( Figure 4).…”
Section: Resultsmentioning
confidence: 99%
“…Copper and their alloys present a lower formation of biological deposits (biofouling) due to, probably, toxic characteristics of the Cu ions (II) coming from the metal dissolution 10,11 . Thus, when the substrate is toxic for the microorganisms, a greater production of EPM than on no toxic samples, such as gold, was observed ( Figure 4).…”
Section: Resultsmentioning
confidence: 99%
“…However, after different exposure times, diatoms and protozoa adhere to the metal surface forming biofilms. Toxic characteristics of the 70/30 copper-nickel alloy impose a pretreatment of the surface through the excretion of abundant EPS excreted by microorganisms [21]. Only isolated bacteria adhered to the surface of 70/30 copper-nickel samples after 7 days in seawater exposure (Fig.…”
Section: Thermoelectric Power Plantsmentioning
confidence: 99%
“…This was mainly due to precipitation of copper salts, adsorption of organic, adherence of biological materials. Detachment of the protective layers was produced in certain areas; preferential dissolution of copper (probably Cu2O) was observed in those areas where anion diffusion was restricted (such as under the external layer or between grains) [21].…”
Section: Thermoelectric Power Plantsmentioning
confidence: 99%