Corrosion in Electronics

Synergetic effect of temperature and humidity on the leakage of KOH electrolyte and related reliability of zinc-air batteries

“…The hygroscopic nature of the residues was clearly depicted in this test and therefore, the leakage of KOH electrolyte inside an electronic device can lower the RH boundary for the device through the process of deliquescence and will therefore cause thick water layer formation. Variety of electronics failure modes due to humidity has been reported previously, of which the thickness of water layer formed on the electronic components like PCBA is the most critical factor determining the reliability of electronics (Piotrowska et al, 2015;Conseil-Gudla et al, 2017;Ambat et al, 2018). This is significantly affected by the presence of ionic contamination on the PCBA surface and their hygroscopicity.…”

Using machine learning algorithms to predict failure on the PCB surface under corrosive conditions

“…For condensation, the dew point range and the size of dew droplet formation on the PCB surface are affected by climatic conditions [51]. Climatic conditions can also influence in increasing the absolute humidity (AH) to interact with PCB surface, reducing the deliquescent relative humidity (RH) level and increasing solubility for contamination, and extending the deposition process for ECM through the increasing electrochemical process [52,53]. The levels of both temperature and RH have proportional with the actual environment and deliquescence of solder flux activators [54].…”

Amino Acids as Activators for Wave Solder Flux Systems: Investigation of Solderability and Humidity Effects

“…Particularly, the ionic and hygroscopic contaminants on PCBAs reduce the humidity boundary for water condensation [8]. The most frequently used WOAs in the flux formulation today include glutaric acid, succinic acid and adipic acid etc.…”