Corrosion front roughening in two-dimensional pitting of aluminum thin layers

Balázs, Läszlö

doi:10.1103/physreve.54.1183

Cited by 35 publications

(31 citation statements)

References 19 publications

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“…In contrast, anodic dissolution smooths out the pores dissolving material around them. This peculiar behavior of symmetry breaking and formation of rough cathodic and smooth anodic regions is experimentally found in experiments on corrosion of aluminum foil in quasi 2D experiments [24,25].…”

Section: Resultssupporting

confidence: 61%

Corrosion-passivation processes in a cellular automata based simulation study

2013

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A short survey of cellular automata based models for corrosion and passivation phenomena is given. Results of simulations based on the model of spatially separated anodic and cathodic reactions are presented for a cavity development from a point-like damage of a protective layer and from an initially flat unprotected surface. We show some new peculiar examples of the symmetry breaking in the cavity development. The results for the initially flat surface show roughening of the surface at the beginning of the corrosion process. After that, pit merging causes a resmoothing of the surface. An oscillatory behavior of the surface roughness is observed caused by a peninsula formation with subsequent island detachment. These results are obtained in 2D because of computational limitations. We plan simulations in 3D and point out the problems we encounter in their realization.

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Section: Resultssupporting

confidence: 61%

Corrosion-passivation processes in a cellular automata based simulation study

2013

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“…This paper presents a detailed study of a minimal model inspired by recent experiments on pit corrosion of aluminum thin films by an appropriate etching solution [8]. This two dimensional model is a simplified etching model.…”

Section: Introductionmentioning

confidence: 99%

Surface hardening and self-organized fractality through etching of random solids

2000

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When a finite volume of etching solution is in contact with a disordered solid, complex dynamics of the solid-solution interface develop. If the etchant is consumed in the chemical reaction, the dynamics stop spontaneously on a self-similar fractal surface. As only the weakest sites are corroded, the solid surface gets progressively harder and harder. At the same time it becomes rougher and rougher uncovering the critical spatial correlations typical of percolation. From this, the chemical process reveals the latent percolation criticality hidden in any random system. Recently, a simple minimal model has been introduced by Sapoval et al. to describe this phenomenon. Through analytic and numerical study, we obtain a detailed description of the process. The time evolution of the solution corroding power and of the distribution of resistance of surface sites is studied in detail. This study explains the progressive hardening of the solid surface. Finally, this dynamical model appears to belong to the universality class of Gradient Percolation.

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“…In other cases it is useful, for example when one wishes to roughen a smooth surface for adhesion or to obtain some specific optical or esthetic properties. Such processes are also stimulating from a theoretical point of view since it has been observed in experiments [2,3,4] that they can give rise to complex patterns and dynamics.To understand the universal features of random etching processes, the study of simplified toy models is useful since they allow to grasp some essential results using the concepts of percolation theory [5]. The randomness of the solid may be caused either by the topology of the chemical bonds, such as in amorphous media, or by fluctuations of the composition, such as in a solid solution.…”

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confidence: 99%

Percolation-dependent reaction time in the etching of disordered solids

Kolwankar¹,

Plapp²,

Sapoval³

2003

Europhys. Lett.

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A prototype statistical model for the etching of a random solid is investigated in order to assess the influence of disorder and temperature on the dissolution kinetics. At low temperature, the kinetics is dominated by percolation phenomena, and the percolation threshold determines the global reaction time. At high temperature, the fluctuations of the reaction rate are Gaussian, whereas at low temperature they exhibit a power law tail due to chemical avalanches. This is an example where microscopic disorder directly induces non-classical chemical kinetics. Pacs: 64.60.Ak, 05.65.+b Chemical etching of disordered solids is a process of great practical importance [1]. In some cases, such as in corrosion, it can be a cause of undesirable deterioration. In other cases it is useful, for example when one wishes to roughen a smooth surface for adhesion or to obtain some specific optical or esthetic properties. Such processes are also stimulating from a theoretical point of view since it has been observed in experiments [2,3,4] that they can give rise to complex patterns and dynamics.To understand the universal features of random etching processes, the study of simplified toy models is useful since they allow to grasp some essential results using the concepts of percolation theory [5]. The randomness of the solid may be caused either by the topology of the chemical bonds, such as in amorphous media, or by fluctuations of the composition, such as in a solid solution. It can also be the randomness of a passivation layer that may appear spontaneously in the corrosion of polycrystalline solids.In this letter, we focus on the time evolution of the etching process and the influence of temperature. In the previous studies of random etching, random site resistances were assigned, and "strong" sites were never etched [6,7,8]. This has given a theoretical interpretation to the spontaneous stabilization of fractal surfaces in a model where the etchant is consumed in the course of the reaction [6,7,8]. The fluctuations observed in [2] were interpreted in terms of a self-organized fractal growth linked to percolation theory [7].However, if the disorder is at some microscopic level, it is more realistic to assign random reaction rates to the dispersed random elements of the solid. Then, even a site with a very small dissolution rate will eventually be etched. Furthermore, since real reaction rates are temperature-dependent, the influence of this parameter can be studied. In the following, we find a transition from smooth and continuous growth at high temperatures to a highly intermittent regime at low temperatures that exhibits chemical avalanches.The 2d square lattice model of the solid consists of elements i that have a random site-dependent binding energy E i . The dissolution rate R i of a molecule i in contact with the etchant is supposed to follow an Arrhenius law that corresponds to an activated process:where C is the concentration of the etchant, k B is Boltzmann's constant, and T is the temperature. For simplicity, the att...

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Corrosion front roughening in two-dimensional pitting of aluminum thin layers

Cited by 35 publications

References 19 publications

Corrosion-passivation processes in a cellular automata based simulation study

Corrosion-passivation processes in a cellular automata based simulation study

Surface hardening and self-organized fractality through etching of random solids

Percolation-dependent reaction time in the etching of disordered solids

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