Corrosion behavior of electroless nickel/immersion gold plating by interfacial morphology

Lee, Dongjun; Huh, Seok-Hwan; Kim, Chi-Seong; Mun, Sungho; Shin, Han-Kyun; Lee, Hyojong

doi:10.1007/s13391-015-4446-x

Cited by 4 publications

(2 citation statements)

References 12 publications

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“…Electroless nickel/immersion gold (ENIG) process plays a great role in the microelectronics eld as a nal nish. [1][2][3] The ENIG lms are extensively applied in Printed Circuit Boards (PCBs) because of its excellent electrical conductivity, planarity, good solderability, and corrosion resistance. [4][5][6][7][8] The cyanide gold plating containing potassium dicyanoaurate (KAu(CN) 2 ), as the source of gold in the immersion gold (IG) bath, has been widely used to obtain gold coating on Ni-P alloy substrate due to its outstanding advantages, such as the bath stability and the superior performance of the obtained coating.…”

Section: Introductionmentioning

confidence: 99%

Effects of organic additives on the immersion gold depositing from a sulfite–thiosulfate solution in an electroless nickel immersion gold process

Wang

Liu

et al. 2016

RSC Adv.

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Section: Introductionmentioning

confidence: 99%

Effects of organic additives on the immersion gold depositing from a sulfite–thiosulfate solution in an electroless nickel immersion gold process

Wang

Liu

et al. 2016

RSC Adv.

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“…[2][3][4] Especially, electroless Ni and gold depositions have been extensively employed to protect the Cu circuits of the high interconnection density board, due to their excellent corrosion resistance and solderability. [5][6][7][8] Typically, conventional electroless Ni deposition using hypophosphite as the reducing agent is an autocatalytic process. However, electroless Ni deposition cannot be applied to a Cu surface.…”

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confidence: 99%

Nucleation and Growth Behaviors of Pd Catalyst and Electroless Ni Deposition on Cu (111) Surface

Huh

Choi

Shin

et al. 2015

J. Electrochem. Soc.

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The electroless nickel plating process was used for protecting the copper pad of printed circuit boards from oxidation, which needs Pd catalytic treatment on the copper surface before Ni growth. The quantity of Pd deposition had a linear relationship with the activation time, while the Ni growth on the Pd-activated Cu films was accelerated with the deposition time by auto-catalytic reaction. It was confirmed that both Pd and Ni were grown coherently on the Cu (111) plane based on the high-resolution TEM measurement. The in-plane lattice misfits of Pd (111) and Ni (111) to Cu (111) are 7.6% (compressive) and 2.5% (tensile), respectively. The Pd grew in a dot-like rather than a two-dimensional form due to the large lattice mismatch. In addition, the lattice mismatch of Ni (111) to Pd (111) is 9.4% (tensile), and the larger lattice misfit seems to make it difficult for the Ni to nucleate on the Pd nuclei. It can be deduced that the Pd works simply as an electron supplier by oxidizing a reducing agent and the Ni reduction occurs preferably on the Cu surface by an electron from the Pd.

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Corrosion behavior of PCB-ENIG in a simulated marine atmospheric environment with industrial pollution

Zhang¹

2020

International Journal of Electrochemical Science

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In this work, the corrosion behavior of printed circuit board finished with electroless nickel immersion gold (PCB-ENIG) in a simulated marine atmospheric environment with industrial pollution is studied through corrosion topography observation, electrochemical measurement and surface Kelvin potential analysis. The results show that at the initial stage, micropores corrosion is the main damage formation for PCN-ENIG. However, the initial corrosion products accumulate on the sample surface and block the micropores, restrict the infiltration process of chloride ions and hydrogen ions. Therefore, the surface Kelvin potential and electron transfer resistance increase at initial stage. As the extending of exposure time, some localized corrosion products shed off due to the crack initiation, resulting in the direct exposure of substrate Cu to the acid salt spray environment. Consequently, the coating loses the protection effects on Cu.

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Corrosion behavior of electroless nickel/immersion gold plating by interfacial morphology

Cited by 4 publications

References 12 publications

Effects of organic additives on the immersion gold depositing from a sulfite–thiosulfate solution in an electroless nickel immersion gold process

Effects of organic additives on the immersion gold depositing from a sulfite–thiosulfate solution in an electroless nickel immersion gold process

Nucleation and Growth Behaviors of Pd Catalyst and Electroless Ni Deposition on Cu (111) Surface

Corrosion behavior of PCB-ENIG in a simulated marine atmospheric environment with industrial pollution

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