Corrosion Behavior of Cu-Al Intermetallic Compounds in Copper Wire Bonding in Chloride-Containing Accelerated Humidity Testing

Liu, Dong; Chen, Haibin; Wu, Jingshen; Then, E.

doi:10.1109/ectc.2016.271

Cited by 13 publications

(4 citation statements)

References 31 publications

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“…in alloys with al content less than 8 wt. %, the microstructure of aluminum bronze is monophasic and consists of α By increasing the al content, intermetallic compounds (imCs) are formed throughout structure, such as al 4 Cu 9 (γ) and κ phases that increase the number of potential sites for galvanic coupling and as a result, reduce the corrosion resistance of these alloys when are exposed to the corrosive environment [47,50,51]. Based on the evidences achieved, in seawater, rapid selective phase and general corrosion can be occurred in aluminum bronzes and nickel-aluminum bronzes [50,[52][53][54].…”

Section: Corrosion Behaviormentioning

confidence: 99%

Archives of Metallurgy and Materials

2022

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Surface alloying of cupronickel alloy with aluminum uSing tungSten inert gaS proceSSSurface melting and alloying of Copper-nickel (Cupronickel) alloy by preplacing aluminum powder and using tungsten inert gas process (tiG) in shielded atmosphere of argon gas were investigated. Surface melting resulted in the formation of a fairly porous dendritic microstructure. Surface alloying with aluminum resulted in the formation of al 2 Cu and al 4 Cu 9 intermetallic compounds along with Cu-rich matrix and unstable martensitic structure. Surface melting reduced the hardness from 140 hV 0.1 (substrate) to 70 hV 0.1 , mainly due to the loss of cold work effect of the initial substrate. on the other hand, surface alloyed zone showed a hardness of 300 hV 0.1 , mainly due to the formation of intermetallic compound. tafel polarization results indicated improvement in corrosion resistance of cupronickel alloy after surface melting and alloying.

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Section: Corrosion Behaviormentioning

confidence: 99%

Archives of Metallurgy and Materials

2022

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“…In addition, the problem of halide-induced corrosion of Cu wires and Al bond pads has been found as one of the most significant reliability issues. Typically, these corrosion defects can also occur in the low ppm range from aggressive low-chloride impurities in the packaging process [4,5]. One of the prevailing strategies to reduce these corrosion defects is the utilization of palladium (Pd) coated Cu wire (PCC), which only partially solves the corrosion problem [6][7][8].…”

Section: Introductionmentioning

confidence: 99%

“…Meanwhile, Boettcher et al's further investigated the corrosion rate of the Cu/Al IMC species at the interface, finding that the Cu-rich phase corrodes faster compared to the Al-rich phase [17]. Liu et al also studied the corrosion behavior of Cu/Al IMC in a chloride environment resulting in selective IMC corrosion with a high corrosion rate [4].…”

Section: Introductionmentioning

confidence: 99%

Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire Bonding Reliability

Chyan,

Durai,

Kumaravel

et al. 2024

IMAPSource Proceedings

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Copper wire bonding, with its advantages of higher electrical conductivity and better mechanical strength, has replaced gold wire bonding as a proven cost-effective electrical interconnection solution for IC packaging for the past 15 years. Early development of Cu wire bonding required overcoming of several technical challenges including bond pad damage caused by copper’s hardness and brittleness relative to gold. A more chemistry related challenge of using Cu as bonding wire is its well-known reactivity with oxygen. Inert atmospheric envelope of forming gas surrounding bonding capillary was developed to prevent oxidation of Cu wire during electronic flame off to enable a strong bonding. Another more elusive materials-chemistry related reliability challenge, with a typical low ppm occurrence, has been the chloride-induced corrosion defects between the Cu wire and Al bond pad. The opportunistic low-level chloride contaminations can originate from various points of packaging manufacturing process flow and often render it un-trackable. In this talk, we present recent efforts to systematically control interfacial materials chemistry across Cu bonding wire, Cu/Al bimetallic contacts and CuxAly intermetallic compounds with the aim to eliminate corrosion defects and improve the overall bonding reliability. The current prevailing manufacturing solution is to utilize Pd-coated Cu bonding wire that can only partially mitigate the CuxAly intermetallic corrosion vulnerability. We utilized a real-time corrosion screening metrology to explore the underlying interfacial materials chemistry drives vigorous corrosion between Cu wire and Al bond pad when exposed to trace level of chloride contaminant. Combining with SEM, sensitive infrared spectroscopy and electrochemical characterization, our data show strategic surface modification on both Cu bonding wire and exposed CuxAly intermetallic can have a significant impact on reducing corrosion defect rates. The obtained mechanistic insights provide several new strategies enabled by a novel Cu-selective passivation coating technology to effectively mitigate Cu wire bonding corrosion defects. Implications on further improving overall Cu wire bonding reliability will be present based on these new approaches that have low-cost and packaging friendly advantages.

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“…Figure16. Publication number of keyword "corrosion" and "wire bonding" in conference and journal 2010 to 2020 from Scopus after source of affiliation analysis.…”

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confidence: 99%

Review on Corrosion in Electronic Packaging Trends of Collaborative between Academia–Industry

2022

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This article reviews corrosion in electronic packaging mainly in the semiconductor industry over the world. The previous study was reviewed scientifically to highlight the significant work on corrosion in electronic packaging. A total of 467 and 762 studies were found in the IEEE Explore and Scopus databases from 2010 to 2020, respectively. After the search was limited to articles and proceedings, the databases showed only 319 from IEEE and 694 from Scopus. The keywords searching for this topic also emphasized corrosion wire bonding, corrosion leadframe, and corrosion solder. When searching for articles and proceedings were divided into three (3) categories such as academia, industry, and collaborative works, the database from collaborative works showed only 57 and 108 results in IEEE and Scopus, respectively. The studies were classified according to the process after some analysis using Microsoft Excel. Most of the previous studies were on corrosion in electronic packaging. From the study, we found that most of the journal articles were published by academia while the proceeding was published by industry. This information was extracted from IEEE Explore and Scopus databases. Since 2010, the trend of collaborative works among the industry and academia showed increased from 13 to 165 total publications in 2020. This review is significant to give an overview of the collaborative works between industry and academia on the corrosion issue in electronic packaging.

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Corrosion Behavior of Cu-Al Intermetallic Compounds in Copper Wire Bonding in Chloride-Containing Accelerated Humidity Testing

Cited by 13 publications

References 31 publications

Archives of Metallurgy and Materials

Archives of Metallurgy and Materials

Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire Bonding Reliability

Review on Corrosion in Electronic Packaging Trends of Collaborative between Academia–Industry

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