Corrosion Assessment of Sn-0.7Cu Lead-Free Solder in 1 M Hydrochloric Acid

Abstract

The corrosion performance of Sn-0.7Cu solder alloy is investigated in 1 M Hydrochloride acid by means of potentiodynamic polarization technique at the scan range of -2VSCE to 1 VSCE was applied to the sample at the scan rate of 1mV/s. Supporting morphological analysis was done by using Scanning Electron Microscope while phase analysis was confirmed by using X-ray Diffraction analysis. Morphological analysis showed two type of oxide layer has formed as corrosion product, which are compact oxide layer and loose rod-like oxide layer after corrosion analysis which confirmed to be SnO and SnO2. This indicate that complete protection from further corrosion was impossible due to the incomplete passivation layer formation.