Corrigendum to “Wettable flank routable thin MicroLeadFrame for automotive applications” [Microelectron. Reliab. 135 (2022) 114602]

Kim, Byong Jin; Jeon, HyeongIl; Gijeong, Kim,; Cho, Nam-Hee; Khim, JinYoung; Kim, Yeong K.

doi:10.1016/j.microrel.2022.114781

Cited by 1 publication

(1 citation statement)

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“…For UTS handling, bonding is the mainstream method. [8,[27][28][29][30] UTS can be bonded to a temporary handle layer and it can be debonded after all processes are complete. This can avoid UTS from breaking, cracking, bending, or warping.…”

Section: Introductionmentioning

confidence: 99%

Dual Coil Patterned Ultra‐Thin Silicon Film Enable by Double‐Sided Process

Son

Lee

Ferreira

et al. 2023

Adv Materials Inter

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Double‐sided microfabrication process on an ultra‐thin silicon film has rarely been attempted due to the challenges in terms of the preparation and handling of a thin film in spite of its promising fabrication potentials. Such a process allows for doubling the thin film device density or providing dual functionalities for a thin film depending on whether the front and back sides of a thin film are processed identically or distinctively. Here, a novel double‐sided thin film processing strategy is introduced by realizing a dual coil patterned ultra‐thin silicon film that is working as an actuating or energy harvesting system. Experimentally, a dual coil patterned thin film enabled using the introduced approach shows remarkably enhanced device performance when compared with a single coil patterned counterpart. Furthermore, a multiphysics simulation model is developed and the resultant modeling data validate the experimentally measured performance enhancement. Finally, the structural durability of the thin film upon cyclic loading is tested and its diverse vibration modes are investigated.

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