Corrigendum to “Peak-type charge barriers enabling high surface-insulating performance of epoxy composites” [Compos. Sci. Technol. 229 (2022) 109706]

Luo, Zimin; Zhao, Yushun; Bai, Jinhui; Yang, Kang; Xu, Yufan; Liu, Ding; Du, Bin

doi:10.1016/j.compscitech.2022.109786

Cited by 1 publication

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“…1 With the rapid development of microelectronic integration and assembly technology, electronic devices were gradually developing toward high frequency, high-temperature resistance, excellent insulation, and high integration. [2][3][4] With the continuous miniaturization of the volume of electronic components and logic circuits, and the continuous improvement of working frequency, the heat generated in unit volume will increase significantly during operation. [5][6][7] However, due to the significant thermal resistance of traditional electronic packaging materials, heat accumulation accelerates the aging of packing insulation materials, which dramatically reduces the working efficiency and service life of electrical and electronic equipment.…”

Section: Introductionmentioning

confidence: 99%

High‐temperature resistance and excellent electrical insulation in epoxy resin blends

Zhang

Liu

Zhang

et al. 2023

J of Applied Polymer Sci

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The packaging insulation material was a crucial component to guarantee the stable and safe operation of electronic devices. Epoxy resin, one of the most popular packaging materials, was widely used as an electronic packaging material because of its good corrosion resistance and electrical insulation, low price, and easy processing and molding. However, the unsatisfied heat resistance cannot meet the requirements of the rapid development of third‐generation power semiconductors, so it was meaningful to modify the epoxy resin with both excellent heat resistance and insulation. In this paper, tetrafunctional epoxy resin AG70 and phenolic epoxy resin F51 was blended in different proportions to combine their individual advantages, and the microstructure and electrical/thermal properties of epoxy resin blends had been systematically studied. The results showed that with the increase of blending ratio of AG70 with F51, both high glass transition temperature of 213.3°C and electric breakdown of 206.1 kV/mm were achieved when the blending ratio was 5:5, displaying excellent overall performances and exhibiting great application potential in electronic and microelectronic industries.

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