Abstract:Residual stress profiles in silica glass were measured after water diffusion treatment under 47.33 kPa (355 Torr) water vapor at 350 • C and 650 • C. Earlier, it was found that water solubility in silica glass exhibited peculiar time dependence: Solubility increased with time exceeding the normal water solubility expected from higher temperatures. Then, the water solubility decreased with time. It was hypothesized that the stress induced by water diffusion and its subsequent relaxation is responsible for the p… Show more
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