2010
DOI: 10.1016/j.corsci.2010.08.024
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Correlations between intergranular stress corrosion cracking, grain-boundary microchemistry, and grain-boundary electrochemistry for Al–Zn–Mg–Cu alloys

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Cited by 269 publications
(121 citation statements)
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“…[5,102] Recent work suggested a relationship between intergranular stress corrosion crack growth rates (region 2) and the initial open-circuit electrochemical potential (OCP) for brittle intergranular fracture surfaces exposed to an aqueous saline solution for peak-and overaged AA7075 and AA7079 alloys, with higher crack growth rates being associated with more negative OCPs. [102] Arguments stemming from these observations maybe strengthened by: (a) obtaining further evidence the simulated intergranular fracture surface generated by mechanical fast fracture at a low temperature is representative of an intergranular sustained-load fracture surface and (b) the use of an aqueous test solution more representative of the local environments known to exist in crack-tip regions of propagating stress corrosion cracks, which are not simple aerated aqueous saline solutions, but acidified de-aerated environments containing a significant concentration of dissolved aluminum species. [62,104] Other studies have indicated that OCP and pitting potentials for Al-Zn-Mg(-Cu) alloys exposed to aqueous saline solutions at room temperature increase logarithmically with an alloy's copper content.…”
Section: Mechanistic Implicationsmentioning
confidence: 99%
“…[5,102] Recent work suggested a relationship between intergranular stress corrosion crack growth rates (region 2) and the initial open-circuit electrochemical potential (OCP) for brittle intergranular fracture surfaces exposed to an aqueous saline solution for peak-and overaged AA7075 and AA7079 alloys, with higher crack growth rates being associated with more negative OCPs. [102] Arguments stemming from these observations maybe strengthened by: (a) obtaining further evidence the simulated intergranular fracture surface generated by mechanical fast fracture at a low temperature is representative of an intergranular sustained-load fracture surface and (b) the use of an aqueous test solution more representative of the local environments known to exist in crack-tip regions of propagating stress corrosion cracks, which are not simple aerated aqueous saline solutions, but acidified de-aerated environments containing a significant concentration of dissolved aluminum species. [62,104] Other studies have indicated that OCP and pitting potentials for Al-Zn-Mg(-Cu) alloys exposed to aqueous saline solutions at room temperature increase logarithmically with an alloy's copper content.…”
Section: Mechanistic Implicationsmentioning
confidence: 99%
“…High stress-corrosion cracking strength and low stresscorrosion cracking plateau velocity could be attained using the T7 temper ( Ref 12,13). The present study evaluated the effects of processing factors, such as deformation at cryogenic temperatures, on the mechanical properties and corrosion resistance of 7075-T73 alloy samples with and without anodization and sealed treatment.…”
Section: Introductionmentioning
confidence: 99%
“…However, it is well known that over-aging in Al-Zn-Mg-Cu alloys can improve the resistance to IGC and SCC, partly because more Cu incorporates in the Mg(Zn,Al,Cu) 2 precipitates at the grain boundaries for the over-aged sample. 18,21 Moreover, a Cu-rich Al alloy was shown to exhibit lower SCC growth rate than a Cu-lean Al alloy. 13 From the discussion above, it can be seen that the role of Cu in the IMPs, the matrix solid solution and the grain boundary precipitates on the corrosion behavior is complicated.…”
Section: Role Of Almentioning
confidence: 99%
“…The higher Cu content in the η-phase resulting from overaging is considered to be beneficial to the resistance to intergranular corrosion (IGC) and stress corrosion cracking (SCC). 18,21 The goal of the present study is to establish the correlation between microstructure evolution, electrochemical behavior and pitting corrosion damage under the salt-spray environment in commercial Cu-rich AA7055 and an experimental Cu-free Al-Zn-Mg alloy with different aging conditions, and to further investigate the role of Cu in the pitting corrosion. The microstructure evolution and electrochemical behavior of the two Al alloys in various aging conditions were studied by transmission electron microscope (TEM) and polarization measurements.…”
mentioning
confidence: 99%