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1995
DOI: 10.1063/1.360347
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Correlation of YBa2Cu3O7 step-edge junction characteristics with microstructure

Abstract: Current-voltage characteristics, Josephson radiation spectra, and critical current versus magnetic-field dependences were measured in epitaxial, c-axis YBa2Cu3O7 step-edge Josephson junctions (SEJs) on SrTiO3 and LaAlO3 substrates with various step angles α. The results were correlated with microstructural data to determine the origin of the observed weak-link behavior. It was shown that on steps with α≳45° the SEJ is a series connection of two weak links unambiguously correlated with the occurrence of two 90°… Show more

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Cited by 55 publications
(30 citation statements)
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“…9(b)]. This technique, initially realized by Simon et al (1991), was subsequently refined by several groups Sun, Gallagher, Callegari et al, 1993;Herrmann et al, 1995;Pettiette-Hall et al, 1995;Yi et al, 1996). Common substrate materials are SrTiO 3 and LaAlO 3 .…”
Section: Step-edge Grain-boundary Junctionsmentioning
confidence: 99%
See 1 more Smart Citation
“…9(b)]. This technique, initially realized by Simon et al (1991), was subsequently refined by several groups Sun, Gallagher, Callegari et al, 1993;Herrmann et al, 1995;Pettiette-Hall et al, 1995;Yi et al, 1996). Common substrate materials are SrTiO 3 and LaAlO 3 .…”
Section: Step-edge Grain-boundary Junctionsmentioning
confidence: 99%
“…It has been proposed that the grain boundaries formed at step edges behave as junctions because of their defect structure (Herrmann et al, 1995), since 90°g rain boundaries in planar films do not exhibit such behavior. Thus the properties of step-edge junctions depend strongly on the microstructure of the milled step and on the film-growth conditions, leading to greater spreads in parameters than for bicrystal junctions.…”
Section: Step-edge Grain-boundary Junctionsmentioning
confidence: 99%
“…The goal of our investigation was to establish an IBE-process which produces a steep clean step angle <708 as a base for step edge junctions in order to reduce the spread in the 1/f-noise of our rf-SQUIDs. Using a rotating substrate and an angle of incidence of 458 of the ion beam with regard to the surface of the substrate we achieve a clean step with a step angle <508 (process 1) [12]. An alternative method is to align the direction of a ®xed ion beam parallel to the long edge of the trench forming photoresist mask (process 2).…”
Section: Hts-squid Preparation and Characterizationmentioning
confidence: 99%
“…This technique, initially realized by Daley et al (1990), was subsequently refined by several groups (Herrmann et al, 1991(Herrmann et al, , 1995Sun et al, 1993;Yi et al, 1996). Common substrate materials are perovskites (001) SrTiO 3 and (001) LaAlO 3 .…”
Section: Bicrystal Grain Boundary Junctionsmentioning
confidence: 99%