Correlation between magnetic and mechanical properties of devitrified glass-coated Fe71.8Cu1Nb3.1Si15B9.1 microwires

simple transistors and logics to highly integrated microcontrollers and displays, the latter of which utilizes some of the most technologically advanced processes available in the industry. [3] The success of these technologies has been achieved through enhanced integration of various active functional blocks such as transistors, digital logics, and analog circuits, along with advances in miniaturization and simplification of the overall manufacturing process, eventually leading to large scale, parallel fabrication of silicon chip-based microelectronic components and systems. [4,5] However, many of the manufacturing steps in assembling these electronic components remain either semiparallel or sequential in nature, including processes as dicing, pick and place, packaging, and final assembly of the device. Each additional sequential step increases costs and should ideally be avoided, however substantial streamlining is not always feasible in complex manufacturing processes. [6] More critically, highly integrated silicon-based devices still require several external supporting components for their operation such as wiring, powering, sensing, and communications that cannot be easily integrated within the planar surface of a silicon die. Thus, sensors, actuators, capacitors, coils, antennas, and optics, each crucial for the complete system, are typically placed separately from the silicon chip onto a printed circuit board (PCB), or integrated within another package (Figure 1a). While the need for ever decreasing sizes has demanded tremendous investments and efforts in the manufacture of completed assemblies, the miniaturizing of 3D electronic components (Figure 1b) and systems has nevertheless reached the range of mesoscopic sizes (<1 mm) where the manufacture and assembly of components experience challenges with respect to yield, costs, and reliability. [7] As a result, these issues limit the fabrication potential and commercial viability of components and systems to scales around 1 mm, [8] and despite efforts to improve the planar construction of mesoscopic 3D devices, the results are seen as inefficient and experience difficulties in achieving high performances while maintaining reasonable complexity. Despite the great success in manufacturing active electronics, such concerns are strongly related to the fabrication of passive electronic components like inductors, capacitors, antennas, and resonators where material properties (e.g., mechanical, magnetic, and electrical) and geometry play a crucial role. [8,9] In order to downscale these devices further and improve integration with active electronics, novel fabrication strategies are required.Electronic devices and their components are continually evolving to offer improved performance, smaller sizes, lower weight, and reduced costs, often requiring the state-of-the-art manufacturing and materials to do so. An emerging class of materials and fabrication techniques inspired by self-assembling biological systems shows promise as an alternative to the more traditional m...

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Section: Self‐assembled Electronic Devices and Their Shapementioning

confidence: 99%

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Karnaushenko

Kang

Schmidt

2019

Adv Materials Technologies

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“…Therefore, for the case of fragile crystalline metallic nucleus (like the case of Heusler-type or Finemet-type nanocrystalline microwires), the glass coating can reinforce the mechanical properties. But for "thick" glass-coated microwires, the glass coating cracks upon strong bending and can be removed from the metallic nucleus [126].…”

Section: Heusler-type Microwiresmentioning

confidence: 99%

Correlation of Crystalline Structure with Magnetic and Transport Properties of Glass-Coated Microwires

et al. 2017

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Abstract:We overviewed the correlation between the structure, magnetic and transport properties of magnetic microwires prepared by the Taylor-Ulitovsky method involving rapid quenching from the melt and drawing of the composite (metallic core, glass coated) wire. We showed that this method can be useful for the preparation of different families of magnetic microwires: soft magnetic microwires displaying Giant magnetoimpedance (GMI) effect, semi-hard magnetic microwires, microwires with granular structure exhibiting Giant Magnetoresistance (GMR) effect and Heusler-type microwires. Magnetic and transport properties of magnetic microwires depend on the chemical composition of metallic nucleus and on the structural features (grain size, precipitating phases) of prepared microwires. In all families of crystalline microwires, their structure, magnetic and transport properties are affected by internal stresses induced by the glass coating, depending on the quenching rate. Therefore, properties of glass-coated microwires are considerably different from conventional bulk crystalline alloys.

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“…However, one of the advantages of glass-coated microwires is that the glass coating of micrometric thickness is rather flexible. There- fore, the effect of the nanocrystallization on the mechanical properties of these microwires is generally smaller than the one produced by annealing on conventional amorphous alloys (ribbons and conventional wires) due to the existence of the glass coating [5], [34], [35]. In addition, as-prepared Fe 73.8 Cu 1 Nb 3.1 Si 13 B 9.1 nanocrystalline microwires are less brittle.…”

Section: Methodsmentioning

confidence: 99%

Effect of Nanocrystallization on Magnetic Properties and GMI Effect of Microwires

et al. 2014

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We studied giant magnetoimpedance (GMI) effect and magnetic properties of FINEMET-type FeCuNbSiB microwires. We observed that the GMI effect and magnetic softness of glass-coated microwires produced by the Taylor-Ulitovski technique can be tailored either controlling magnetoelastic anisotropy of as-prepared FeCuNbSiB microwires or controlling their structure by heat treatment or changing the fabrication conditions. We observed considerable magnetic softening of studied microwires after annealing. This magnetic softening correlates with the devitrification of amorphous samples. Amorphous microwires exhibited low GMI effect (GMI ratio below 5%). Considerable enhancement of the GMI effect (GMI ratio up to 100%) has been observed in heat treated microwires with nanocrystalline structure. Some of as-prepared Fe-rich exhibited nanocrystalline structure and the GMI ratio up to 45%.Index Terms-Giant magnetoimpedance (GMI) effect, magnetic anisotropy, thin microwires.

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Correlation between magnetic and mechanical properties of devitrified glass-coated Fe71.8Cu1Nb3.1Si15B9.1 microwires

Cited by 74 publications

References 13 publications

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Correlation of Crystalline Structure with Magnetic and Transport Properties of Glass-Coated Microwires

Effect of Nanocrystallization on Magnetic Properties and GMI Effect of Microwires

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