Correlating discrete orientation and grain size to the sputter deposition properties of tantalum

Michaluk, Christopher A.

doi:10.1007/s11664-002-0165-9

Cited by 73 publications

(20 citation statements)

References 16 publications

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“…Recently, Ta sputtering target used in the integrated circuit (IC) industry to fabricate copper diffusion barrier has attracted more and more attention [1][2][3]. Early studies have confirmed that both grain size and crystallographic orientation can play an important role in the sputter deposition properties of Ta [4,5]. The deposition rate of thin film drops with increasing grain size, and the film thickness can be uniform only when the grain size is within a certain range [6].…”

Section: Introductionmentioning

confidence: 99%

Effects of Annealing Temperature on Recrystallization Texture and Microstructure Uniformity of High Purity Tantalum

Zhu

Deng

Liu

et al. 2019

Metals

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One hundred and thirty-five degree clock rolling significantly improves the texture homogeneity of tantalum sheets along the thickness, but a distinctly fragmented substructure is formed within {111} (<111>//normal direction (ND)) and {100} (<100>//ND) deformation grains, which is not suitable to obtain a uniform recrystallization microstructure. Thus, effects of different annealing temperatures on the microstructure and texture heterogeneity of tantalum sheets along the thickness were investigated by X-ray diffraction (XRD), electron backscatter diffraction (EBSD) and transmission electron microscopy (TEM). Results show that the texture distribution along θ-fiber and γ-fiber is irregular and many large grains with {111} orientation develop during annealing at high temperature. However, low-temperature annealing can not only weaken the texture intensity in the surface and the center layer but also introduce a more uniform grain size distribution. This result can be attributed to the subgrain-nucleation-dominated recrystallization mechanism induced by recovery at low temperature, and moreover, a considerable decline of recrystallization driving force resulting from the release of stored energy in the deformation matrix.

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Section: Introductionmentioning

confidence: 99%

Effects of Annealing Temperature on Recrystallization Texture and Microstructure Uniformity of High Purity Tantalum

Zhu

Deng

Liu

et al. 2019

Metals

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“…Tantalum (Ta), body-centered-cubic (BCC) structure, is a refractory metal with a series of excellent physical and chemical properties, such as corrosion resistance and good ductility, which makes it an ideal material for microelectronics and sputtering targets [1]. The quality of the sputtered film plays a key role in the semiconductor integrated circuit industry, and the grain size and crystal orientation distribution of the sputtering target have a direct influence on the quality of the sputtered film [2,3]. Different crystal orientations and grain size can lead to the difference in sputtering rates during magnetron sputtering [4].…”

Section: Introductionmentioning

confidence: 99%

The Effect of Different Annealing Temperatures on Recrystallization Microstructure and Texture of Clock-Rolled Tantalum Plates with Strong Texture Gradient

Zhu

Liu

Yang

et al. 2019

Metals

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The texture and the bulk stored energy along the thickness direction were extremely inhomogeneous in the clock-rolled tantalum sheets with 70% reduction. Therefore, the effects of different annealing temperatures on the microstructure and texture distribution of tantalum plates through the thickness were investigated by X-ray diffraction (XRD) and electron backscatter diffraction (EBSD). The results showed that the occurrence of strong {111} recrystallization texture in the center layer can be attributed to the subgrains nucleation mechanism when annealed at the low temperature. Many subgrains with {111} orientation appeared in the center layer, due to its high stored energy and preferential nucleation sites of the {111} deformed matrix, and rapidly grew into the effective nucleus, resulting in the large {111} grain size and strong {111} texture after complete recrystallization. Contrarily, at the high temperature, high-angle grain boundaries had sufficient driving force to generate migration, due to the lack of recovery, and the growth time of recrystallized nucleus was much shorter, contributing to relatively uniform recrystallization microstructure and texture distribution along the thickness.

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“…The (100) texture bands found in Ta are comprised of striations of recovered or polygonized grains, whereas a matrix of primary (111) texture is characterized as having a fine, equiaxed, grain structure. 10,11 Fabrication of Ta plate by rolling typically results in inhomogeneous crystallographic textures and grain sizes with strong through-thickness gradients. 12 Depending upon the through-thickness position in the plate at which the microstructure is evaluated, one might find a predominantly (100) or (111) texture component (among other variants), resulting in significantly differing sputtering performance as a function of through-thickness position.…”

Section: Introductionmentioning

confidence: 99%

Microstructural development in asymmetric processing of tantalum plate

Field

Yanke

Mcgowan

et al. 2005

Journal of Elec Materi

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Sputtered tantalum (Ta) and TaN are employed as barrier layers in modern integrated circuits to enable reliable use of Cu as an interconnect material. The directional properties of sputtering Ta can result in nonuniform film thicknesses (from heavily textured plate) and unpredictable sputtering rates (from plates with through thickness texture gradients). This results in film thicknesses larger than necessary because of the sputtering being unpredictable. This presentation reports on an effort to increase textural and grain size uniformity in Ta by deforming the plate under conditions that simulate asymmetric rolling. This is accomplished by using a channel die configuration with uneven friction on the top and bottom plates so that a strong shear component is added to the plane strain condition enforced by the channel dies. Results indicate a trend towards less severe texture banding and more uniform structure in the plate processed by asymmetric friction conditions.

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Correlating discrete orientation and grain size to the sputter deposition properties of tantalum

Cited by 73 publications

References 16 publications

Effects of Annealing Temperature on Recrystallization Texture and Microstructure Uniformity of High Purity Tantalum

Effects of Annealing Temperature on Recrystallization Texture and Microstructure Uniformity of High Purity Tantalum

The Effect of Different Annealing Temperatures on Recrystallization Microstructure and Texture of Clock-Rolled Tantalum Plates with Strong Texture Gradient

Microstructural development in asymmetric processing of tantalum plate

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