2002
DOI: 10.1080/00986440213129
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Correlating chemical and water purity to the surface metal on silicon wafer during wet cleaning process

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Cited by 2 publications
(3 citation statements)
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“…A general overview of sample preparation methods is provided here, and full details are provided by Rieck. 1 First, the DLC‐on‐silicon collectors were cleaned with a series of solvents using modified RCA cleaning methods 1 , 19 to remove as much of the crash debris as possible. Then, the samples were mounted face down on rigid, conductive substrates for thinning.…”
Section: Methodsmentioning
confidence: 99%
“…A general overview of sample preparation methods is provided here, and full details are provided by Rieck. 1 First, the DLC‐on‐silicon collectors were cleaned with a series of solvents using modified RCA cleaning methods 1 , 19 to remove as much of the crash debris as possible. Then, the samples were mounted face down on rigid, conductive substrates for thinning.…”
Section: Methodsmentioning
confidence: 99%
“…1,2 In order to avoid contamination because of the chemicals themselves, ultrapurification processes become necessary to achieve these exigent limits. 3 Hydrogen peroxide (H 2 O 2 ) is one of the most employed liquid phase electronic chemicals, which are also called wet chemicals, because it is employed for cleaning silicon wafer surfaces of organic matter, particulated contamination, and metallic impurities.…”
Section: Introductionmentioning
confidence: 99%
“…Electronic chemicals, which are the chemicals and materials used to manufacture and package semiconductors and printed circuit boards, require extremely low content of metallic impurities to minimize reliability problems in microdevices. , In order to avoid contamination because of the chemicals themselves, ultrapurification processes become necessary to achieve these exigent limits . Hydrogen peroxide (H 2 O 2 ) is one of the most employed liquid phase electronic chemicals, which are also called wet chemicals, because it is employed for cleaning silicon wafer surfaces of organic matter, particulated contamination, and metallic impurities. It is also useful to remove photoresists and etch copper on printed circuit boards.…”
Section: Introductionmentioning
confidence: 99%