Correction of FPC solder position error based on mutual information entropy

Huang, Jie‐xian; Ye, Feng; Dong, Zhijie; Li, Di

doi:10.1108/03056121111101287

Cited by 6 publications

(4 citation statements)

References 12 publications

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“…Especially as the IC manufacturing process enters the 7-14 nm process, the FICS's line width and line distance also enter the process below 10 μm, this is also increasing the requirements for material properties and manufacturing processes. At present, the visual defect detection methods for Printed circuit board (PCB) or Flexible printed circuit board (FPC) [1,2] are mainly as follows: reference method [3], nonreference method [4,5] and hybrid method. These methods are difficult to meet the increasing detection speed and accuracy requirements of micro-nano-scale IC package inspection.…”

Section: Introductionmentioning

confidence: 99%

An novel image de-noising model based on gradient and adaptive curvature features and its application

Huang¹,

Hu²

2019

Phys. Scr.

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In this paper, an image de-noising model with gradient and adaptive curvature features is proposed for the visual inspection of the appearance defects of high-density flexible integrated circuit package substrates with strict line-width and line distance. Firstly, the model proposed in this paper adaptively adjusts the weight of the level set curvature feature and the gradient feature of the image, and uses more abundant first-order differential and second-order differential information of the image as the detection factor for image de-noising. Secondly, theoretical analysis shows that the diffusion intensity of the model in the flat region is larger than that of the classical model, and the de-noising effect is better. Furthermore, at the corners and peaks of the image, the proposed model can suppress the reduction of the gray value and preserve more detailed information of the image and edges. Finally, the experimental analysis shows that the proposed model has the best de-noising effect compared with other models. The method proposed in this paper can effectively remove the noise of the image of the high-density flexible integrated circuit package substrate, and at the same time retain more original details and edge information of the image which has practical significance.

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Section: Introductionmentioning

confidence: 99%

An novel image de-noising model based on gradient and adaptive curvature features and its application

Huang¹,

Hu²

2019

Phys. Scr.

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“…It has been widely used in the semiconductor and electronics industries to detect defects such as copper oxidation, ink stains, etc. Currently, many visual defect detection methods for the IC substrates of printed circuit boards (PCBs) and flexible printed circuits (FPCs) have been studied [4][5][6]. These defect vision detection methods can mainly be divided into reference methods [7], nonreference methods [8,9] and mixed methods.…”

Section: Introductionmentioning

confidence: 99%

A fast oxidation region detection algorithm based on differential geometry approach for high-density flexible integrated circuit packaging substrates

Zhong

2018

Meas. Sci. Technol.

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Vision inspection has been widely used in the field of defect measurement as a noncontact, nondestructive measurement technique. Conventional visual defect detection methods rely heavily on standard templates and image features, but the standard templates are either difficult to obtain or do not exist in many application fields, especially in flexible integrated circuit (IC) substrate defect detection at a microscopic level. To solve the above problems, a rapid online oxidation defect detection algorithm for micron-level flexible IC substrate oxidation defects, based on the differential geometric approach, is proposed in this paper. First, the sample fitting model is established by using minimal generalized variance as well as the surface fitting model. Second, the defect area of the substrate is determined by analyzing the similarity and membership, which is coded among the pixels by considering the spatial topological structure of the image. Finally, experiments are performed to show that the algorithm proposed in this paper not only has high precision, but also meets industrial real-time requirements for the rapid production of a flexible substrate. Since the method does not depend on the standard template of the original image, it can achieve vision detection effects at high speed and with high precision.

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“…During the inspection process, false defects cannot be avoided because of the different acquisition times and the variations in lighting. Consequently, morphological operators, such as erosion, dilation and opening and closing, are applied to filter false defects and detect flaws on solder after subtraction (Chen et al , 2007; Wu et al , 2008; Zhao et al , 2009; Huang et al , 2011). The method, to some extent, relies on uniformity of lighting and platform motion accuracy to realize high quality inspection.…”

Section: Introductionmentioning

confidence: 99%

Flaw detection on FPC solder surface

Feng

Li²,

Huang³

et al. 2012

Circuit World

Self Cite

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Purpose -The purpose of this paper is to study the application of advanced computer image processing techniques for flaw detection on flexible printed circuit (FPC) solder. Design/methodology/approach -Texture directionality feature is obtained based on texture gradient, contour's position is extracted and directionality information obtained through analyzing the distribution of directionality. Contour similarity function is established to filter out false contour and keep proper contour, and the solder's location work is accomplished based on reversed contour. After that, a combination of grey and texture gradient's value deviation from reference value is utilized to reflect and describe texture on the solder's surface. Flaw can be distinguished from homogeneous texture background. Findings -The method has been applied to the inspecting system and achieved a higher accuracy and a lower false defect rate. It demonstrates that the method can detect flaws efficiently and effectively. Research limitations/implications -Although the work on FPC solder's location and flaw detection is presented, defective classification is not involved that is also very important content for inspection. Originality/value -The paper provides a new way to locate solder based on directionality. The method not only extracts contour feature but also gains directional parameters to help realize accurate location, especially for some solders that are deformed to some extent. Entropy statistic based on distribution of grey and texture gradient is proposed to describe and measure solder's surface texture. The new algorithm performs stably and efficiently and is fit for practical application.

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Correction of FPC solder position error based on mutual information entropy

Cited by 6 publications

References 12 publications

An novel image de-noising model based on gradient and adaptive curvature features and its application

An novel image de-noising model based on gradient and adaptive curvature features and its application

A fast oxidation region detection algorithm based on differential geometry approach for high-density flexible integrated circuit packaging substrates

Flaw detection on FPC solder surface

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