2018
DOI: 10.1016/j.compositesa.2018.02.021
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Core-shell structured carbon nanotube-poly(methylmethacrylate) beads as thermo-conductive filler in epoxy composites

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Cited by 20 publications
(8 citation statements)
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“…In our previous studies, 25,33 the polymer beads have been utilized to improve the thermal conductivity and thermal properties of polymer composites. The thermally conductive nanoparticles were formed the segregated structure in the presence of polymer beads in the epoxy matrix using hot‐press method 32 .…”
Section: Introductionmentioning
confidence: 99%
“…In our previous studies, 25,33 the polymer beads have been utilized to improve the thermal conductivity and thermal properties of polymer composites. The thermally conductive nanoparticles were formed the segregated structure in the presence of polymer beads in the epoxy matrix using hot‐press method 32 .…”
Section: Introductionmentioning
confidence: 99%
“…Two strong bands at 2995 and 2952 cm −1 are assigned to the C‐H bonds, while peaks at around 3443–3630 cm −1 and 1634 cm −1 are attributed to the O‐H stretching of the absorbed moisture on the PMMA beads . Furthermore, the acrylate carbonyl groups (C=O), ‐CH 3 deformation, and C‐O stretching fluctuations are noticed at 1733, 1390, and 1271 cm −1 , respectively . The oxygen plasma treatment results in the broadening of the sharp peaks of the bare PMMA spectrum as shown in Figure , and the peak at 3439 cm −1 at the spectra of frGO@pPMMA implies the successful wrapping of the frGO on the pPMMA beads.…”
Section: Resultsmentioning
confidence: 94%
“…The negatively charged particles were prepared by introducing oxygenated functional groups onto PMMA surfaces by oxygen plasma treatment as described in a previous report . The plasma treatment of the sample was conducted at the radiation rate of 30 W with a frequency of 13.56 MHz for 5 min and then it was left in the oxygen atmosphere for further 10 min to form oxygenated functional groups (hydroxyl, carbonyl, hydroperoxide, and so on) on the PMMA bead surface .…”
Section: Methodsmentioning
confidence: 99%
“…[3][4][5] The polymer-based composites with various thermally conductive fillers are in high demand as thermal management materials because of their easy processability, low production cost, and lightweight. [6][7][8] In general, the thermally conductive composites are prepared by a random dispersion of the fillers in polymer matrix and the composites require a high filler loading to reach a high thermal conductivity. [9][10][11] However, the high filler loading leads to a deterioration of mechanical properties, the difficulty of processing, and heavyweight.…”
Section: Introductionmentioning
confidence: 99%
“…The remarkable decrease of high A/R CuNW-CNF/ epoxy as compared to the other epoxy composites confirms that the high A/R CuNWs easily form the electrically conductive networks in the composites. Compared to the volume resistivity of the pure epoxy, the volume resistivity of epoxy composites is in the range of 10 −2 to 10 8ΩÁcm which corresponds to the semiconductor range6…”
mentioning
confidence: 99%