2011
DOI: 10.1016/s1452-3981(23)18261-7
|View full text |Cite
|
Sign up to set email alerts
|

Copper Underpotential Deposition on Gold in the Presence of Polyethylene Glycol and Chloride

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2013
2013
2023
2023

Publication Types

Select...
6

Relationship

0
6

Authors

Journals

citations
Cited by 11 publications
(1 citation statement)
references
References 51 publications
0
1
0
Order By: Relevance
“…The accelerator promotes Cu reduction on the bottoms of vias or trenches, while the suppressor and the leveler restrain Cu deposition on the sides of vias or trenches and the superfluous Cu bumps. Among them, the suppressor plays an indispensable role in achieving “bottom-up” filling in Cu interconnects in the presence of chloride ions. In most cases, suppressors are large alkyl-ether polymers or copolymers, such as polyethylene glycol (PEG), polypropylene glycol (PPG), or triblock copolymer composed of ethylene oxide (EO)–propylene oxide (PO)–ethylene oxide (EO) …”
Section: Introductionmentioning
confidence: 99%
“…The accelerator promotes Cu reduction on the bottoms of vias or trenches, while the suppressor and the leveler restrain Cu deposition on the sides of vias or trenches and the superfluous Cu bumps. Among them, the suppressor plays an indispensable role in achieving “bottom-up” filling in Cu interconnects in the presence of chloride ions. In most cases, suppressors are large alkyl-ether polymers or copolymers, such as polyethylene glycol (PEG), polypropylene glycol (PPG), or triblock copolymer composed of ethylene oxide (EO)–propylene oxide (PO)–ethylene oxide (EO) …”
Section: Introductionmentioning
confidence: 99%