Copper Trace Thermomechanical Reliability Analysis of Ball Grid Array Package

Shih, Sean; Lee, Michael Yc; Liao, Tse-Wei; Liu, D.S.; Shih, Meng-Kai; Tarng, David; Hung, Chih-Pin

doi:10.1109/impact.2018.8625799

2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2018

DOI: 10.1109/impact.2018.8625799

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Copper Trace Thermomechanical Reliability Analysis of Ball Grid Array Package

Sean Shih

Michael Yc Lee

Tse-Wei Liao

et al.

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Copper Trace Thermomechanical Reliability Analysis of Ball Grid Array Package

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