Copper Plating on SUS 304 Plate from Acid Bath

Abstract

SUS 304 used. A passive film on surface was needed to remove with anodic electrolytic degreasing in 3.0 mol/dm3 H2SO4 at 298 K. Cu film was electroplated 20 mA/cm2 in 0.5 mol/dm3 CuSO4 and 2 mol /dm3 H2SO4. Current efficiency increased when plating carried in sonication of 28 kHz after plating in stationary state. Particles were destroyed and size became smaller with shockwave pressure. Particles were pressed in pinholes, defects, etc. Surface that was obtained at 28 kHz was smooth and dense compared with other agitation states.