Copper microsphere hybrid mesoporous carbon as matrix for preparation of shape-stabilized phase change materials with improved thermal properties

Abstract

Copper microsphere hybrid mesoporous carbon (MPC-Cu) was synthesized by the pyrolysis of polydopamine microspheres doped with copper ions that were prepared using a novel, facile and simple one-step method of dopamine biomimetic polymerization and copper ion adsorption. The resulting MPC-Cu was then used as a supporter for polyethylene glycol (PEG) to synthesize shape-stabilized phase change materials (PEG/MPC-Cu) with enhanced thermal properties. PEG/MPC-Cu was studied by scanning electron microscopy, X-ray diffraction, Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy, thermogravimetric analysis, differential scanning calorimetry and thermal constant analysis. The results demonstrated that the thermal conductivity of PEG/MPC-Cu was 0.502 W/(m K), which increased by 100% compared to pure PEG [0.251 W/(m K)]. The melting enthalpy of PEG/MPC-Cu was 95.98 J/g, indicating that PEG/MPC-Cu is a promising candidate for future thermal energy storage applications. In addition, the characterization results suggested that PEG-MPC-Cu possessed high thermal stability. Therefore, the method developed in this paper for preparing shape-stabilized phase change materials with improved thermal properties has substantial engineering application prospects.

Silver microsphere doping porous-carbon inspired shape-stable phase change material with excellent thermal properties: preparation, optimization, and mechanism

“…Additionally, the decomposition rate of PEG in 70% PEG/SMS-CSP was higher than that of pristine PEG. This result was due to the higher thermal conductivity of 70% PEG/SMS-CSP than that of the pristine PEG, which accelerated the thermal decomposition of PEG in 70% PEG/SMS-CSP, thus reducing the decomposition temperature of PEG 25 . However, according to the study results, the 70% PEG/SMS-CSP still had high-temperature resistance and excellent thermal stability.…”

ZnO nanowire‐decorated Al2O3/graphene aerogel for improving the thermal conductivity of epoxy composites

“…Therefore, fillers with excellent thermal conductivity are often added into epoxy resin matrix to improve its thermal conductivity. [10] At present, common fillers include metal materials, [11][12][13][14] ceramic materials [15][16][17][18][19] and carbon materials, [20][21][22][23][24] and so forth. Among them, alumina has the advantages of large filling capacity, good stability of particle size, so it is an ideal economic and suitable type of filler.…”

“…At present, common fillers include metal materials, [ 11–14 ] ceramic materials [ 15–19 ] and carbon materials, [ 20–24 ] and so forth. Among them, alumina has the advantages of large filling capacity, good stability of particle size, so it is an ideal economic and suitable type of filler.…”