Copper ion reduction catalyzed by chloride ions

Soares, David Mendez; Wasle, Sabine; Weil, K. G.; Doblhofer, Karl

doi:10.1016/s0022-0728(02)01050-1

Cited by 120 publications

(128 citation statements)

References 21 publications

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“…Fig. 1 shows typical cyclic voltammograms that demonstrate that the reduction current is enhanced by chloride as discussed before [10], but is reduced considerably by the presence of bromide. would be solely due to anodic dissolution/cathodic deposition processes it would be given according to Faraday's law by:…”

Section: Resultsmentioning

confidence: 67%

“…micrograph of the copper surface after contact with an electrolyte containing 4 mM KBr for 3 minutes, indicating that the mass increase is due to a crystalline deposit that forms without current flow. The EDAX analysis conducted as described before [10,20] indicates unambiguously that the deposit is CuBr. It has been shown [10] that CuCl forms at open circuit at the rate of transport of chloride towards the electrode surface.…”

Section: Resultsmentioning

confidence: 94%

“…Recently, we have shown [10] that this intermediate Cu + reacts with chloride to form crystalline CuCl on the copper surface when the solubility product K s is exceeded:…”

Section: Introductionmentioning

confidence: 99%

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The Influence of Halide Ions on the Kinetics of Electrochemical Copper(II) Reduction

Doblhofer¹,

Wasle²,

Soares³

et al. 2003

Zeitschrift Für Physikalische Chemie

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Electrochemistry / Copper / Halides / Mechanism / Electroplating / ElectrorefiningThe cathodic reduction of copper(II) in an electrolyte comparable to technical conditions (2.2 M H 2 SO 4 + 0.3 M CuSO 4 ) is markedly affected by the presence of small concentrations of halide ions. Chloride ions accelerate the reaction, while it is slowed down by bromide. Experiments in which cyclic voltammetry is combined with an electrochemical quartz-crystal microbalance reveal the deposition and dissolution of crystalline CuCl or CuBr, respectively, on the copper surface. At the technically relevant more negative electrode potentials bulk CuCl and CuBr are unstable, however halide ions are adsorbed on the copper electrode. Although there is evidence for adsorption of the reacting Cu(II) species at the electrode surface, up to a concentration of 0.3 M CuSO 4 in presence as well as in absence of adsorbed halogenide, there is no evidence for limiation of the reaction rate caused by a limited coverage of the surface with this species.

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Section: Resultsmentioning

confidence: 67%

Section: Resultsmentioning

confidence: 94%

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The Influence of Halide Ions on the Kinetics of Electrochemical Copper(II) Reduction

Doblhofer¹,

Wasle²,

Soares³

et al. 2003

Zeitschrift Für Physikalische Chemie

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“…The small amounts of additives are added to the main electrolyte solution to control the electrodeposition rate of Cu and improve the electrical properties of the deposited Cu layer. 2,3 The roles of additives can be divided into four groups: (1) accelerator (Cl ¹ ), [4][5][6][7][8][9] (2) polymer (Polyethyleneglycol and polypropyleneglycol), [10][11][12][13][14][15][16] (3) brightener, (Bis(sodiumsulfopropyl)disulfide and 3-mercapto-1-propanesulfonate sodium salt), [17][18][19][20][21] and (4) leveler (Thiourea (TU), [22][23][24] benzotriazol, [25][26][27] and Janus Green B [28][29][30] ). An electrochemical impedance spectroscopy (EIS) has been widely employed to clarify the Cu electrodeposition mechanisms.…”

Section: Introductionmentioning

confidence: 99%

Interpretation of Negative Resistance Observed in Electrochemical Impedance during Copper Electrodeposition Containing Thiourea

et al. 2015

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The effect of the thiourea on the electrochemical impedance during copper electrodeposition was investigated using a rotating ring disk electrode. The rest potential of the copper electrode measured in the solution containing thiourea was shifted to less noble due to the adsorption of thiourea. The cathode polarization curve of the copper electrode demonstrated that the current density of the copper electrode decreased remarkably because of an increase in the concentration of thiourea. The Nyquist plot of impedance spectrum in the presence of the thiourea described the capacitive loop, which was related to the time constant of the charge transfer resistance and the electric double layer capacitance, in the high frequency range and a part of the large locus crossing the imaginary axis in the low frequency range. This low frequency locus is related to negative resistance which contributes to "leveler" effect. In order to clarify the negative resistance, the theoretical equations of the Faraday impedance were derived. We proposed the four steps of the copper electrodepostion reactions in the presence of thiourea.

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“…Conforme reportado na literatura, a redução dos íons Cu(II) formados na presença de íons cloreto passa pela formação de Cu(I) e esta espécie é adsorvida na superfície na forma de CuCl (s) (Soares, Wasle et al, 2002;Gabrielli, Mocoteguy et al, 2006;O'mullane, Neufeld et al, 2008). Os voltamogramas obtidos mostram que a presença de íons cloreto durante o processo de ativação do eletrodo de cobre causa influência significativa na resposta do sensor a íons nitrato.…”

Section: Estudo Da Formação De Espécies Transientes No Processo De Atunclassified

Uso da microscopia eletroquímica no estudo da dinâmica de processos eletródicos em superfícies funcionalizadas

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Copper ion reduction catalyzed by chloride ions

Cited by 120 publications

References 21 publications

The Influence of Halide Ions on the Kinetics of Electrochemical Copper(II) Reduction

The Influence of Halide Ions on the Kinetics of Electrochemical Copper(II) Reduction

Interpretation of Negative Resistance Observed in Electrochemical Impedance during Copper Electrodeposition Containing Thiourea

Uso da microscopia eletroquímica no estudo da dinâmica de processos eletródicos em superfícies funcionalizadas

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