2002
DOI: 10.1016/s0022-0728(02)01050-1
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Copper ion reduction catalyzed by chloride ions

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Cited by 120 publications
(128 citation statements)
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References 21 publications
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“…Fig. 1 shows typical cyclic voltammograms that demonstrate that the reduction current is enhanced by chloride as discussed before [10], but is reduced considerably by the presence of bromide. would be solely due to anodic dissolution/cathodic deposition processes it would be given according to Faraday's law by:…”
Section: Resultsmentioning
confidence: 67%
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“…Fig. 1 shows typical cyclic voltammograms that demonstrate that the reduction current is enhanced by chloride as discussed before [10], but is reduced considerably by the presence of bromide. would be solely due to anodic dissolution/cathodic deposition processes it would be given according to Faraday's law by:…”
Section: Resultsmentioning
confidence: 67%
“…micrograph of the copper surface after contact with an electrolyte containing 4 mM KBr for 3 minutes, indicating that the mass increase is due to a crystalline deposit that forms without current flow. The EDAX analysis conducted as described before [10,20] indicates unambiguously that the deposit is CuBr. It has been shown [10] that CuCl forms at open circuit at the rate of transport of chloride towards the electrode surface.…”
Section: Resultsmentioning
confidence: 94%
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“…The small amounts of additives are added to the main electrolyte solution to control the electrodeposition rate of Cu and improve the electrical properties of the deposited Cu layer. 2,3 The roles of additives can be divided into four groups: (1) accelerator (Cl ¹ ), [4][5][6][7][8][9] (2) polymer (Polyethyleneglycol and polypropyleneglycol), [10][11][12][13][14][15][16] (3) brightener, (Bis(sodiumsulfopropyl)disulfide and 3-mercapto-1-propanesulfonate sodium salt), [17][18][19][20][21] and (4) leveler (Thiourea (TU), [22][23][24] benzotriazol, [25][26][27] and Janus Green B [28][29][30] ). An electrochemical impedance spectroscopy (EIS) has been widely employed to clarify the Cu electrodeposition mechanisms.…”
Section: Introductionmentioning
confidence: 99%
“…Conforme reportado na literatura, a redução dos íons Cu(II) formados na presença de íons cloreto passa pela formação de Cu(I) e esta espécie é adsorvida na superfície na forma de CuCl (s) (Soares, Wasle et al, 2002;Gabrielli, Mocoteguy et al, 2006;O'mullane, Neufeld et al, 2008). Os voltamogramas obtidos mostram que a presença de íons cloreto durante o processo de ativação do eletrodo de cobre causa influência significativa na resposta do sensor a íons nitrato.…”
Section: Estudo Da Formação De Espécies Transientes No Processo De Atunclassified