Copper/graphene composites: a review

Abstract

Recent research upon the incorporation of graphene into copper matrix composites is reviewed in detail. An extensive account is given of the large number of processing methods that can be employed to prepare copper/graphene composites along with a description of the microstructures that may be produced. Processing routes that have been employed are described including powder methods, electrochemical processing, chemical vapour deposition, layer-by-layer processing, liquid metal infiltration among a number of others. The mechanical properties of the composites are described in detail along with an account of the structural factors that control mechanical behaviour. The mechanics and mechanisms of deformation are discussed, and the effect of factors such as the graphene content and the type of graphene used, along with processing conditions for the fabrication of the composites, is described. The functional properties of copper/graphene composites are also reviewed including their electrical and thermal properties, and tribological and corrosion behaviour. In each case, the effect of the graphene type and content, and processing conditions are also described. Finally, possible future applications of copper/graphene composites are discussed.

One-Step Synthesis of Graphene, Copper and Zinc Oxide Graphene Hybrids via Arc Discharge: Experiments and Modeling

“…This could be attributed to graphitic distorted microstructures induced by the presence of copper, including disordered stacking of graphene layers, increased interlayer spacing at the edges of flakes, curved graphene layers on the copper nanoparticles and other structural defects [78]. Similar microstructural variation on the X-ray diffraction intensities was discussed by Li et al [7], during ball milling of hexagonal graphite (h-graphite) and formation of turbostratic carbon (t-carbon). In Figure 8, peaks observed for GrCu samples at 2θ values of 50.9 • , 59.53 • and 88.19 • corresponded to (111), (200) and (220) planes of metallic Cu respectively.…”

“…Hybrid materials can be categorized as structurally hybridized materials (composites) or functionally hybridized materials. In the composites, the matrix is composed of a metal as copper [7,8] and the graphene with low concentration from 0.5 wt % to 5 wt % is used as a filler to provide a higher degree of reinforcement of mechanical or thermal properties. Exceptional mechanical properties of graphene together with its large surface area, good hydrophobicity and enhanced wettability for organic reactants allows for several industrial applications.…”

Electrochemical Deposition of Copper on Epitaxial Graphene

“…In the past decade, huge efforts have been made to conceptualize graphene-copper material hybridization for practical applications [8][9][10][11][12][13]. Particularly, it was discovered that the addition of graphene to the copper matrix can improve the mechanical and electrical properties of Cu, causing a significant increase in the electrical conductivity, Young's modulus, shear modulus, and Vickers hardness as well as a reduction in the thermal expansion coefficient [8][9][10][11]. The aforementioned advantages create excellent prerequisites for copper-graphene (Cu-Gr) composites to be used as reliable interconnection materials, electrical contact materials for ultrahigh-voltage circuit breakers and printed electronics.…”

Microstructure and Mechanical Properties of Mg–14Li–3Al–2Gd Alloy Processed by Multilayer Accumulative Roll Bonding

“…The processing of severe plastic deformation (SPD) can bring about improvement in mechanical properties of alloys. The accumulative roll bonding (ARB) process, which was invented by Saito, [6] has been widely used to manufacture ultrafine-grained alloys and multilayered composites, such as Mg/Mg, [7] Al/Al, [8] Ti/Ti, [9] Al/Mg, [10] Al/Cu, [11] Zn/Sn, [12] Cu/Ag, [13] Al/Al 2 O 3 , [14] Al/B 4 C, [15] and Ti/TiO 2 . [16] Recently, research on ARB has mainly been based on the traditional double-layer and cyclic rolling to achieve grain refinement, interface bonding, and improvement of comprehensive mechanical properties.…”