Copper foil exposed structure for thin PoP warpage improvement

Ahn, Yeseul; Kim, JinSeong; Song, Cha-Gyu; Han, GyuWan; Yoon, Juhoon; Lee, ChoonHeung

doi:10.1109/ectc.2015.7159696

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“…The residual stress evaluation of IC packages has generally been conducted using finite element method (FEM) simulation, [11][12][13] nevertheless the FEM simulation is not correct enough to evaluate a large complicated structure exactly and is time-consuming. Consequently, several studies on real measurement of residual stress using a piezo-resistive sensor embedded Si chip have been reported.…”

Section: Introductionmentioning

confidence: 99%