Copper Electrodeposition on Alkanethiolate Covered Gold Electrodes*

Cavalleri, Ornella; Bittner, Alexander M.; Kind, Hannes; Kern, Klaus; Greber, Thomas

doi:10.1524/zpch.1999.208.part_1_2.107

Cited by 35 publications

(24 citation statements)

References 91 publications

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“…Self-assembled monolayers (SAMs) of aliphatic or aromatic thiols on gold electrodes are frequently employed model systems for a nonconductive surface, onto which a metal has to be deposited. Despite wide-spread usage of proper x-functionalized thiols in order to keep the metal on top of the SAM, common experience in 0039 electrodeposition from solution is the undercreeping of the metal, which finally becomes sandwiched between gold substrate and SAM [11][12][13][14][15][16][17][18][19][20][21][22].…”

Section: Introductionmentioning

confidence: 99%

Metal deposition onto thiol-covered gold: Platinum on a 4-mercaptopyridine SAM

et al. 2005

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Section: Introductionmentioning

confidence: 99%

Metal deposition onto thiol-covered gold: Platinum on a 4-mercaptopyridine SAM

et al. 2005

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“…In addition, Himmelhaus et al concluded that Hg layers could form between the SAM and Au substrate when exposed to Hg vapor [8]. Copper deposition at SAMs has been studied by various methods [11] including voltammetry [12±14] and scanning tunnelling microscopy [12,13]. They were interested in development of SAMs for stripping voltammetry applications.…”

Section: Introductionmentioning

confidence: 99%

Underpotential Deposition of Copper at Mercaptoalkane Sulfonate-Coated Polycrystalline Gold

Arrigan

Iqbal²,

Pickup³

2001

Electroanalysis

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Underpotential deposition (UPD) of copper from aqueous sulfuric acid solution onto polycrystalline gold electrodes coated with 2‐mercaptoethane sulfonate (MES) or 3‐mercapto‐1‐propane sulfonate (MPS) films has been studied. On the basis of peak shape, the UPD reduction process was inhibited by the organosulfonate film, with the greater inhibition being observed for the MPS film. The inhibitory affects in the UPD can be overcome by deposition at a constant underpotential (0.00 V vs. SCE) for a set time. After this set time (≥60 s) the charge for stripping of the underpotential deposit was equivalent to the charge recorded for UPD stripping at the bare polycrystalline gold surface.

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“…Numerous papers dealing with alternative electrodes and techniques have been published recently. Among these, the glassy carbon electrode, 2 graphite electrode, [3][4][5] gold electrode, 6 silver electrode, 7,8 and bismuth electrode 9 are important contributions. But, except for the bismuth electrode, there is a major drawback for these types of electrodes-their use is limited below 2800 mV, restricted by the lack of hydrogen overvoltage.…”

Section: Introductionmentioning

confidence: 99%

Alloy electrodes with high hydrogen overvoltage for analytical use in voltammetry. Some preliminary results

Mikkelsen

Schrøder

2000

Analyst

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Liquid mercury and liquid diluted mercury amalgams have been the major electrode systems employed in voltammetry and related methods. This is mainly due to their high overvoltage to hydrogen, which enables the determination of heavy metals (zinc, nickel, cobalt, etc.) and other species with high negative half-wave potentials; the toxicity of mercury and liquid diluted mercury leads to ever increasing restrictions in their use. The use of such systems may even be forbidden in the future, at least in online systems for work in the field. Recent work, carried out in our laboratory, has demonstrated that a non-toxic solid dental amalgam may be used as the electrode material, conveniently replacing mercury. An extension of this work has shown that electrode materials comprising a metal or a compound with low hydrogen overvoltage change their hydrogen overvoltage properties substantially when contaminated with even small amounts of metals or compounds which show high hydrogen overvoltage. This extends greatly the range of potentially available electrode systems and thereby analytical possibilities of voltammetry. This new discovery also makes it possible to produce solid electrodes that have high overvoltage to hydrogen without any use of mercury.

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Copper Electrodeposition on Alkanethiolate Covered Gold Electrodes*

Cited by 35 publications

References 91 publications

Metal deposition onto thiol-covered gold: Platinum on a 4-mercaptopyridine SAM

Metal deposition onto thiol-covered gold: Platinum on a 4-mercaptopyridine SAM

Underpotential Deposition of Copper at Mercaptoalkane Sulfonate-Coated Polycrystalline Gold

Alloy electrodes with high hydrogen overvoltage for analytical use in voltammetry. Some preliminary results

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