Cooling Computer Chips with Cascaded and Non-cascaded Thermoelectric Devices

Al-Shehri, Saleh

doi:10.1007/s13369-019-03862-2

Cited by 7 publications

(8 citation statements)

References 30 publications

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“…A multi-phase project is currently being conducted that uses TE technology for cooling hotspots of high-speed computer chips. These phases include: (a) conducting experimental tests to investigate the suitability of using TEMs to cool computer chips [65], (b) assessing the effect of various shapes of the pulsed current on the TEC performance for cooling microprocessors at different conditions [66], (c) developing a general 3-D TE model for optimizing the performance of cascaded and non-cascaded TEGs and TECs [50,51,[65][66][67][68], and (d) using the 3-D model to explore the potential abilities of using cascaded and non-cascaded TEMs (operating in TEC mode and TEG mode) for cooling chip hotspots of high heat fluxes at no or minimal external electrical power requirements. It is important to emphasize that all the major parameters that affect the performance of such a system will be considered in the project.…”

Section: Objectivesmentioning

confidence: 99%

“…As TEG is a reliable static energy conversion device (i.e., no moving parts) that can be designed with high redundancy, it is quite an attractive technology that is widely being used in advanced radioisotope power systems (ARPSs) for space applications [41][42][43][44][45][46][47][48][49]. Additionally, the electrical power density and conversion efficiency of the TEG (η TEG ) can be significantly increased by using segmented TEG [47][48][49] and cascaded TEG [44][45][46]50,51]. Both TEC and TEG can be fabricated in various sizes from the micro scale to the macro scale for different applications [41][42][43][44][45][46][47][48][49][50][51][52][53].…”

Section: Introductionmentioning

confidence: 99%

“…Additionally, the electrical power density and conversion efficiency of the TEG (η TEG ) can be significantly increased by using segmented TEG [47][48][49] and cascaded TEG [44][45][46]50,51]. Both TEC and TEG can be fabricated in various sizes from the micro scale to the macro scale for different applications [41][42][43][44][45][46][47][48][49][50][51][52][53]. With TEC, Lee et al [54] studied a dynamic thermal management method that was regulated adaptively based on live data.…”

Section: Introductionmentioning

confidence: 99%

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Sustainable Self-Cooling Framework for Cooling Computer Chip Hotspots Using Thermoelectric Modules

2021

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The heat generation from recent advanced computer chips is increasing rapidly. This creates a challenge in cooling the chips while maintaining their temperatures below the threshold values. Another challenge is that the heat generation in the chip is not uniform where some chip components generate more heat than other components. This would create a large temperature gradient across the chip, resulting in inducing thermal stresses inside the chip that may lead to a high probability to damage the chip. The locations in the chip with heat rates that correspond to high heat fluxes are known as hotspots. This research study focuses on using thermoelectric modules (TEMs) for cooling chip hotspots of different heat fluxes. When a TEM is used for cooling a chip hotspot, it is called a thermoelectric cooler (TEC), which requires electrical power. Additionally, when a TEM is used for converting a chip’s wasted heat to electrical power, it is called a thermoelectric generator (TEG). In this study, the TEMs are used for cooling the hotspots of computer chips, and a TEC is attached to the hotspot to reduce its temperature to an acceptable value. On the other hand, the other cold surfaces of the chip are attached to TEGs for harvesting electrical power from the chip’s wasted heat. Thereafter, this harvested electrical power (HEP) is then used to run the TEC attached to the hotspot. Since no external electrical power is needed for cooling the hotspot to an acceptable temperature, this technique is called a sustainable self-cooling framework (SSCF). In this paper, the operation principles of the SSCF to cool the hotspot, subjected to different operating conditions, are discussed. As well, considerations are given to investigate the effect of the TEM geometrical parameters, such as the P-/N-leg height and spacing between the legs in both operations of the TEC mode and TEG mode on the SSCF performance.

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Section: Objectivesmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Sustainable Self-Cooling Framework for Cooling Computer Chip Hotspots Using Thermoelectric Modules

2021

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“…Mosaffa et al [17,18] investigated the coefficient of performance COP of two-stage refrigeration for the purpose of free cooling, and the optimal COP (7.0) was better than single-stage refrigeration. Along with that, the application of cascade utilization of cold energy is also able to reduce the stress of pipes by reducing the temperature difference [19,20]. However, the adjusting method of the multi-stage temperature of cold resource has not been applied in the ice plug freezing system.…”

Section: Introductionmentioning

confidence: 99%

Formation Rate and Energy Efficiency of Ice Plug in Pipelines Driven by the Cascade Utilization of Cold Energy

Hu,

Zhang,

et al. 2024

Energies

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Ice plug technology is an effective method for isolating the pipeline system, which are promising methods utilized in the nuclear, chemical, and power industries. To reduce the cold energy consumption and temperature stress, the multi-stage (1–10) of time-dependent thermal boundary conditions was proposed for the formation of ice plug, while the gradient cooling wall temperature of multi-stage was applied. A numerical model considering the liquid–solid phase change, heat transfer, and time-dependent thermal boundary condition has been established. The effects of the ratio of length and diameter of the cooling wall lc/d (1–9) on the formation rate and heat flux of ice plug in the pipe has been investigated. The fastest formation rate of ice plug with 800 mm in the axial direction (7.47 cm3/s) was observed in the pipe with the lc/d of 5. The formation rate of ice plug and the ice formation volume under unit energy consumption VE under various stages (1–10) of cooling wall temperature have been compared. The VE of eight temperature stages (1.45 cm3/kJ) was 1.16 times than the VE of one temperature stage, which satisfied the freezing rate at the same time. This investigation provides insight for proposing an energy-saving system for the formation of ice plug.

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“…Chen et al systematically summarized the research progress of the most advanced on-chip thermoelectric cooling devices, and pointed out the development prospects of the design, performance and application of onchip thermoelectric cooling devices [46]. Saleh used TEC to fabricate a sustainable selfcooling frame for cooling chip hot spots, which successfully cooled the hot spots at an acceptable temperature and reduced the unevenness of chip temperature distribution [48]. Li et al proposed a chip-on-TEC for active thermal management of high-power light-emitting diodes (LED), and the study showed that at an operating current of 1.0 A, it not only reduced the chip temperature by 51% but also increased light output power of the LED [49].…”

Section: Introductionmentioning

confidence: 99%

Numerical Simulation on Thermoelectric Cooling of Core Power Devices in Air Conditioning

Wang¹,

Hu²,

Tang³

et al. 2023

Preprint

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Air conditioners are indispensable necessities in daily life and industrial production. However, the heat generation of their internal core power components can limit their performance release. In this work, we explore the application of thermoelectric coolers (TECs) in the field of power device heat dissipation through finite element simulation. First, we geometrically modeled the structure and typical operating conditions of core power devices in air conditioners. We compared the temperature fields in air cooling and TEC active cooling modes for high power consumption power devices in a 319 K operating environment. The simulation results show that in the single air cooling mode, the maximum temperature of the 173.8 W power device reaches 394.4 K and the average temperature reaches 373.9 K, which exceeds its rated operating temperature of 368.1 K. However, after adding TEC, the maximum temperature of the power device drops to 331.8 K at an operating current of 7.5 A and the average temperature of the device is 326.5 K. It indicates that TEC active cooling has a significant effect on the temperature control of the power device. At the same time, we also studied the effect of TEC working current on the temperature control effect of power devices. For TEC, there is a minimum working current of 5 A; when it is less than 5 A, TEC has no cooling effect; the cooling effect of TEC increases with an increase in working current. When the TEC working current is 10 A, the average temperature of the power device can be reduced to 292.9 K. This study has made a meaningful exploration of the application of TEC in chip temperature control and heat dissipation, providing a new solution for chip thermal management and accurate temperature control.

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Cooling Computer Chips with Cascaded and Non-cascaded Thermoelectric Devices

Cited by 7 publications

References 30 publications

Sustainable Self-Cooling Framework for Cooling Computer Chip Hotspots Using Thermoelectric Modules

Sustainable Self-Cooling Framework for Cooling Computer Chip Hotspots Using Thermoelectric Modules

Formation Rate and Energy Efficiency of Ice Plug in Pipelines Driven by the Cascade Utilization of Cold Energy

Numerical Simulation on Thermoelectric Cooling of Core Power Devices in Air Conditioning

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