Cooling characteristics of diamond-shaped interrupted cooling fin for high-power LSI devices

Kishimoto, T.; Saski, S.

doi:10.1049/el:19870328

Cited by 64 publications

(29 citation statements)

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“…On the other hand, singlephase liquid flow with heat transfer enhancement features has potential to achieve comparable heat transfer performance, and at the same time, avoiding the high pumping power requirement and complexity of two-phase flow systems [11]. This concept was first proposed in 1987 [12], where the heat transfer enhancement techniques found in conventional channels were successfully introduced in microchannels.…”

Section: Introductionmentioning

confidence: 99%

Nature-inspired Inverted Fish Scale microscale passages for enhanced heat transfer

Goh

Ooi

2016

International Journal of Thermal Sciences

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Section: Introductionmentioning

confidence: 99%

Nature-inspired Inverted Fish Scale microscale passages for enhanced heat transfer

Goh

Ooi

2016

International Journal of Thermal Sciences

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“…In early 1981, a proposed micro channel heat sink was first used for cooling a large-scale integrated circuit [12]. Later a micro channel with diamond-shaped interrupted micro-grooved cooling fins was used to enhance the performance and reduce the LED junction temperature [13]. Several methods have been discussed in the past decade to solve the high junction temperature issue, such as fans, heat sinks, heat pipes and the micro-thermoelectric devices [14].…”

Section: Introductionmentioning

confidence: 99%

Thermal management technology of high-power light-emitting diodes for automotive headlights

Yang²,

Zheng

et al. 2014

IEICE Electron. Express

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Abstract:The heat dissipation problem of high-power LEDs (Light-Emitting Diodes) limits their applications in automobile headlights. The heat demand for cooling LED headlights is analyzed based on heat transfer theory. This study proposes an initiative heat dissipation technology of temperature feedback control combined heat pipe and heat sink. The corresponding hardware and software control processes are designed. The temperature feedback control is realized with an MCU (Micro Control Unit) that judges and controls the synthetic jet device working process. A 3D model for the heat pipe radiator is constructed using CATIA. The model is optimized with the fluid thermodynamic simulation software FLOEFD. Finally, a sample lamp is prepared and tested with an infrared thermometer. The temperature distribution on each LED light source and radiator fin is quantitatively measured and analyzed. These results confirm that the designs of the thermal management system and the proposed technique solve the heat dissipation problem of high-power LED automotive headlights under the ambient temperature 50°C indeed.

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“…Also, a number of methods for reducing the pressure drop have been reported, including subdividing the flow into multiple heat exchanger zones with shorter channel lengths (Harpole and Eninger 1991) and manifold designs with large cross-sectional areas (i.e., areas equal to or larger than the channel cross-sectional area) (Webb 2003). In addition, staggered fins (i.e., fins that are offset or staggered fin segments) in microchannel coolers have been found to increase the heat transfer coefficient compared to continuous fins (Kishimoto and Sasaki 1987;Colgan et al 2005).…”

Section: Introductionmentioning

confidence: 99%

Silicon Microchannel Cooling for High Power Chips

Colgan¹,

Furman²,

Gaynes³

et al. 2006

HVAC&R Research

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In this work, single-phase Si microchannel coolers have been designed and characterized for cooling very high power density chips in single-chip modules (SCMs) in a laboratory environment. The average heat transfer coefficient was determined for a wide range of microchannel designs. Through the use of multiple heat exchanger zones and optimized cooler fin design, an average unit thermal resistance of 16.2°C·mm 2 /W between the chip surface and the inlet cooling water was demonstrated for an Si microchannel cooler attached to a chip with Ag epoxy in an SCM. Very good uniformity from SCM to SCM (±2%) and within an SCM (±5%) was achieved. Further, cooling of a thermal test chip with a microchannel cooler bonded to it and packaged in an SCMwas also demonstrated for a chip power density greater than 400 W/cm 2 . Coolers of this design should be able to cool chips with average power densities of 500 W/cm 2 or more.

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Cooling characteristics of diamond-shaped interrupted cooling fin for high-power LSI devices

Cited by 64 publications

References 0 publications

Nature-inspired Inverted Fish Scale microscale passages for enhanced heat transfer

Nature-inspired Inverted Fish Scale microscale passages for enhanced heat transfer

Thermal management technology of high-power light-emitting diodes for automotive headlights

Silicon Microchannel Cooling for High Power Chips

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