2022
DOI: 10.1002/admi.202201860
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Conversion of ALD CuO Thin Films into Transparent Conductive p‐Type CuI Thin Films

Abstract: Copper iodide (CuI) is a high‐performance p‐type transparent semiconductor that can be used in numerous applications, such as transistors, diodes, and solar cells. However, the lack of conformal and scalable methods to deposit CuI thin films limits its establishment in applications that involve complex‐shaped and/or large substrate areas. In this work, atomic layer deposition (ALD) is employed to enable scalable and conformal thin film deposition. A two‐step approach relying on ALD of CuO and its subsequent co… Show more

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Cited by 8 publications
(6 citation statements)
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“…By comparing the growth modes [52] , island growth, as the dominant growth mode on pEGDMA, was found, while nucleation on pHEMA was more similar to layer-by-layer growth. These results revealed that the density of reactant sites affected the nucleation behavior for ALD substrates [69] . Weiß et al compared the GPC of ALD CuO films on Si, Al 2 O 3 , and TiO 2 substrates at room temperature.…”
Section: The Reaction Substrate Of Aldmentioning
confidence: 88%
See 1 more Smart Citation
“…By comparing the growth modes [52] , island growth, as the dominant growth mode on pEGDMA, was found, while nucleation on pHEMA was more similar to layer-by-layer growth. These results revealed that the density of reactant sites affected the nucleation behavior for ALD substrates [69] . Weiß et al compared the GPC of ALD CuO films on Si, Al 2 O 3 , and TiO 2 substrates at room temperature.…”
Section: The Reaction Substrate Of Aldmentioning
confidence: 88%
“…A similar phenomenon was found by Jur et al [68] . Demelius et al investigated the PE-ALD growth of ZnO on polyethylene glycol dimethacrylate (pEGDMA) and poly 2-hydroxyethyl methacrylate (pHEMA) [69] . They discovered more intense precursor diffusion in pEGDMA with fewer reactive sites.…”
Section: The Reaction Substrate Of Aldmentioning
confidence: 99%
“…CuI thin films were deposited via gas phase conversion from CuO thin films made by ALD. 37 In short, ALD CuO thin films were deposited according to Iivonen et al , 38 using bis(dimethylamino-2-propoxy) copper( ii ) (Cu(dmap) 2 ) and ozone (O 3 ) as precursors.…”
Section: Methodsmentioning
confidence: 99%
“…Some inorganic ammonium salts have been demonstrated to serve as effective interfacial passivators, effectively reducing defects at the ETL/perovskite interface. [ 48 ] Cui et al. employed ammonium silicofluoride (ASF) as interfacial passivator at the TiO 2 /CsPbBr 3 interface.…”
Section: Defect Regulationmentioning
confidence: 99%