Convection Heat Transfer in Electronic Equipment Cooling

Abstract

To maintain the best possible thermal environment in electronic packages, the engineer must establish the most efficient path for heat transfer from the electronic devices to an external cooling agent. The path is typically subdivided into internal and external components, representing, respectively, heat transfer by conduction through different materials and interfaces separating the devices from the package surface and heat transfer by convection from the surface to the coolant. Depending on the scale and speed of the electronic circuits, as well as on constraints imposed by nonthermal considerations, the coolant may be a gas or a liquid and heat transfer may be by natural, forced, or mixed convection or, in the case of a liquid, by pool or forced convection boiling. In this paper a comprehensive review of convection cooling options is provided.

Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels

“…13 Yet, an elusive goal is to have an efficient cooling down process which improves the overall reliability of the devices and circuitry -enhancing the performance. 12,14,15 This is because of the multiple dependencies of semiconductors' electrical properties on temperature, starting from underlying electronic structure such as the forbidden energy gap (E g ) range 16 up to the actual current (I D ) flowing in the devices [17][18][19] ; these relations are described by Varshni's empirical expression (Equation (1)) and current dependence on temperature (T) (Equation (2)), respectively.…”

“…For heat management, traditionally, additional accessories are added into the integrated circuits (ICs) using off-chip fans, for providing forced convection, and heat sinks for providing a large surface area for free-convection and heat radiation but, as a trade-off, making the whole system bulky -counterproductive of the idea of ultra-mobility. 5,[8][9][10][11][12] Figure 1 highlights the typical arrangement of key IC packaging in a ceramic ball grid array (CBGA) package, with the primary heat flow path starting from the silicon die to the thermal interface material and heat spreader then to the heat sink and ambient. 13 Yet, an elusive goal is to have an efficient cooling down process which improves the overall reliability of the devices and circuitry -enhancing the performance.…”

A Numerical Study of Mixed Convection in Square Lid-Driven with Internal Elliptic Body and Constant Flux Heat Source on the Bottom Wall

“…Examples of mixed convection processes can be found in connection with heat exchangers, hot-wise anemometers, nuclear reactors, electronic devices, atmospheric boundary-layer flows, solar collectors, energy storage and heat rejection systems, etc. [1]. Al-Amiri et al [2] investigated numerically steady mixed convection in a square lid-driven cavity under the combined buoyancy effects of thermal and mass diffusion.…”

Optimal Design of Plate-Fin Heat Sink under Natural Convection Using a Particle Swarm Optimization Algorithm

“…Therefore, thermal management becomes a fundamental but crucial element in electronic product design. Many cooling methods have been proposed to maintain the temperature of electronic components in safety zone [4][5][6], like thermoelectric cooling, air cooling and liquid cooling. Due to their inherent simplicity, operational safety and low long-term cost, natural convection heat sinks have been widely used in cooling electronic components.…”