Controlling βSn grain orientations in electronic interconnects with single-crystal Cobalt substrates

L., Z.; Li, Chuan; Shen, Yang; Cheng, Xingwang

doi:10.1016/j.actamat.2020.04.059

Cited by 11 publications

(5 citation statements)

References 52 publications

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“…Cyclic twinning is not generally observed in pure Sn [18]. This particular type of twinning is common in tetragonal and orthorhombic minerals, but is less frequently observed in metal systems [17,19]. That is to say that SnAg eutectic will all change to six-fold cyclic twinning when sufficiently heated and sufficiently supercooled (supercooling greater than 80°C is required).…”

Section: Fig4 Contact Angles Of Composite Solder Pastes Doped With Di...mentioning

confidence: 99%

Effect of CoSn3 nanocrystals on Sn3Ag plating for electronic packaging

Wang,

Zhang,

et al. 2023

Preprint

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Plating Sn3Ag on copper substrates represents a crucial electronic packaging technique. In this study, we propose a novel composite plating approach, wherein CoSn3 nanocrystals (NS) are deposited within the Sn3Ag coating. The resulting reflowed Sn3Ag joints exhibit a range of distinctive properties. Notably, CoSn3 nanocrystals dissolve in Sn during the reflow process, thereby lowering the supercooling required for Sn nucleation. Consequently, Sn crystals grow in six-fold cyclic twins. Additionally, the dissolution of Co atoms in Sn leads to a reduced solubility of Cu atoms in Sn, consequently lowering the supercooling required for the nucleation of Cu6Sn5. Simultaneously, this phenomenon promotes the nucleation of Cu6Sn5, resulting in a considerable precipitation of CuSn5 nanoparticles within the joints. Therefore, the mechanical properties of the joints are significantly enhanced, leading to a notable 20% increase in shear strength. Furthermore, the presence and distribution of Co elements within Sn induce changes in the growth pattern of interfacial Cu6Sn5. The growth process of Cu6Sn5 is dominated by the interfacial reaction, leading to its growth in a faceted shape. During the aging process, the dissolution of Co elements in Sn impedes the continuous growth of Cu6Sn5 at the interface, causing Cu6Sn5 to be distributed in the form of islands inside the joint. Remarkably, elemental Co acts as an inhibitor for the development of Cu3Sn and reduces the occurrence of Kirkendall voids.

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Section: Fig4 Contact Angles Of Composite Solder Pastes Doped With Di...mentioning

confidence: 99%

Effect of CoSn3 nanocrystals on Sn3Ag plating for electronic packaging

Wang,

Zhang,

et al. 2023

Preprint

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“…We have also previously reported that elemental Co induces Sn to form six-fold cyclic twins (a.k.a. beach ball structures) more readily . So, we would like to realize the six-fold cyclic twinning of Sn with the help of Co doping to achieve better service reliability of Cu-pillar bumps.…”

Section: Introductionmentioning

confidence: 99%

“…beach ball structures) more readily. 6 So, we would like to realize the six-fold cyclic twinning of Sn with the help of Co doping to achieve better service reliability of Cu-pillar bumps. The addition of Co elements has emerged as an effective strategy for regulating the growth of intermetallic compounds, as demonstrated in previous studies.…”

Section: Introductionmentioning

confidence: 99%

“…The addition of Co elements has emerged as an effective strategy for regulating the growth of intermetallic compounds, as demonstrated in previous studies. 6 − 9 However, incorporating Co elements into copper pillar bumps presents a novel challenge, mainly due to the susceptibility of Co nanoparticles to oxidation, which can lead to the formation of CoO inclusions during storage and reflow procedures. Therefore, we need to find an intermetallic compound nanoparticle that provides Co atoms, and preferably, this compound will not become aggregately intercalated.…”

Section: Introductionmentioning

confidence: 99%

“… Effect of the Co substrate and Co elemental doping on the supercooling required for Sn nucleation (data from refs ( 5 ) and ( 6 )). …”

Section: Introductionmentioning

confidence: 99%

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Synthesis and Atomic Transport of CoSn₃ NanoIMC by In Situ TEM

Wang,

Zhang

et al. 2023

ACS Omega

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In order to optimize the interfacial properties by adding Co to the bumps of copper pillars and to overcome the strong tendency of Co to oxidize, an intermetallic compound (IMC) “capsule” was developed for the purpose of transporting elements through the intermetallic compound. In this study, we present a comprehensive analysis of the transformation process of CoSn2 nanoparticles into CoSn3 at the nanoscale using in situ heating transmission electron microscopy (TEM). The experimental results reveal that CoSn2 nanoparticle growth occurs through polymerization, whereas CoSn3 nanoparticle formation relies on the reaction between CoSn2 and Sn. During the initial stages of the reaction, Co dissolves and diffuses into Sn, leading to the nucleation and growth of CoSn2 in Sn via Ostwald ripening. As the input energy increases, vacancies in CoSn2 drive a reaction at the Sn/CoSn2 interface, resulting in the generation of CoSn3. In this process, Sn nanoparticles enter the CoSn2 structure through the “Anti Structure Bridge (ASB) mechanism” to fill vacancies. Following the codeposition process, CoSn3 nanoparticles were successfully plated within the Sn layer of the Cu-pillar bumps. Upon reflow heating, the CoSn3 nanoparticles exhibited a preference for precipitating the vacant sites within the Sn layer. This process facilitated the release of Co atoms from CoSn2, enabling their diffusion throughout the entire Sn layer.

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Bi Dispersion Hardening in Sn-Bi Alloys by Solid-State Aging

Shen

2023

JOM

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Controlling βSn grain orientations in electronic interconnects with single-crystal Cobalt substrates

Cited by 11 publications

References 52 publications

Effect of CoSn3 nanocrystals on Sn3Ag plating for electronic packaging

Effect of CoSn3 nanocrystals on Sn3Ag plating for electronic packaging

Synthesis and Atomic Transport of CoSn₃ NanoIMC by In Situ TEM

Bi Dispersion Hardening in Sn-Bi Alloys by Solid-State Aging

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Controlling βSn grain orientations in electronic interconnects with single-crystal Cobalt substrates

Cited by 11 publications

References 52 publications

Effect of CoSn3 nanocrystals on Sn3Ag plating for electronic packaging

Effect of CoSn3 nanocrystals on Sn3Ag plating for electronic packaging

Synthesis and Atomic Transport of CoSn3 NanoIMC by In Situ TEM

Bi Dispersion Hardening in Sn-Bi Alloys by Solid-State Aging

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Product

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Synthesis and Atomic Transport of CoSn₃ NanoIMC by In Situ TEM