2014
DOI: 10.1016/j.apsusc.2013.11.099
|View full text |Cite
|
Sign up to set email alerts
|

Controlling formation of gold nanoparticles generated in situ at a polymeric surface

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
16
0

Year Published

2014
2014
2021
2021

Publication Types

Select...
7

Relationship

1
6

Authors

Journals

citations
Cited by 22 publications
(16 citation statements)
references
References 65 publications
0
16
0
Order By: Relevance
“…Moreover, the amine could partially reduce Au(III) to Au(I) with loss of HCl and formation of an Au(I)-imine complex [48]. Activity of enzyme immobilized on prepared carriers was presented in Table 2.…”
Section: Enzyme Immobilizationmentioning
confidence: 99%
“…Moreover, the amine could partially reduce Au(III) to Au(I) with loss of HCl and formation of an Au(I)-imine complex [48]. Activity of enzyme immobilized on prepared carriers was presented in Table 2.…”
Section: Enzyme Immobilizationmentioning
confidence: 99%
“…In the copper deposition process (Figure ), a polymeric surface is first aminated then treated with aqueous HAuCl 3 to bind Au(III) to the pendant amines. The Au(III)‐treated surface is then exposed to NaBH 4 , which reduces the gold cations, forming gold nanoparticles in situ . The resulting gold‐nanoparticle‐decorated polymer is then exposed to an aqueous solution of Cu(II) and formaldehyde.…”
Section: Resultsmentioning
confidence: 99%
“…Immediately following amination, the sample was rinsed with water and immersed in a 0.53 × 10 −3 m aqueous solution of HAuCl 4 for 2 h. The sample was then removed from the gold bath, rinsed with water, and immersed in 0.1 m aqueous NaBH 4 for 2 min to generate gold nanoparticles by in situ reduction on the polymer matrix . The samples were then removed from the reduction bath, rinsed in water, and immersed in a copper plating bath for 7 min .…”
Section: Methodsmentioning
confidence: 99%
“…It has been used to prepare submicron electrical interconnects [2], polystyrene/silver (PS/Ag) microspheres for filling applications in anisotropic conductive films [3], reductive platinum (Pt) catalyst [4], silicon and germanium semiconductors with copper (Cu) nanofilms [5], and functionalized polymer surfaces with gold (Au) nanoparticles [6]. EL Au plating was recently used to create ordered arrays of metal nanoparticles [1,7].…”
Section: Introductionmentioning
confidence: 99%