2013
DOI: 10.1016/j.jmatprotec.2012.10.001
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Controlling Al/Cu composite diffusion layer during hydrostatic extrusion by using colloidal Ag

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Cited by 35 publications
(13 citation statements)
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“…Hence, interfacial reactions between copper and aluminum are technically and scientifically important in many technological applications. Many scholars have studied different processing methods for fabricating Cu/Al couples, such as diffusion bonding [3][4], friction stir welding [5][6], compound casting [7][8], and hydrostatic extrusion [9]. It is well known that with different methods and conditions, different intermetallic compounds (IMCs) are likely to form at the Cu/Al interface.…”
Section: Introductionmentioning
confidence: 99%
“…Hence, interfacial reactions between copper and aluminum are technically and scientifically important in many technological applications. Many scholars have studied different processing methods for fabricating Cu/Al couples, such as diffusion bonding [3][4], friction stir welding [5][6], compound casting [7][8], and hydrostatic extrusion [9]. It is well known that with different methods and conditions, different intermetallic compounds (IMCs) are likely to form at the Cu/Al interface.…”
Section: Introductionmentioning
confidence: 99%
“…5 is that the highest MH can be achieved at P S of 120 MPa. It is due to the fact that at low P S premature solidification occurs which propagates nucleation and micro cracks which in turn reduce the hardness of joint interface [4,19].…”
Section: Parametric Main Effects Plotsmentioning
confidence: 99%
“…Manufacturing of high-performance materials at a competitive cost is now the essential demand of industry for their survival in this competitive environment. Among the different options, overcast manufacturing seems to be an attractive alternative [3,4]. But in overcast manufacturing, the desired properties can only be achieved if a suitable joining technique is selected.…”
Section: Introductionmentioning
confidence: 99%
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“…The diffusion layer is mainly composed of ferrite and pearlite. Lee [12] examined the effect of different temperatures, pressure rates, and intermediate layers on the composite diffusion behavior of Al/Cu. A prediction model of the thickness of the diffusion layer and the hardness of the interface was established by the regression method.…”
Section: Introductionmentioning
confidence: 99%