Controlled Synthesis of Triangular Submicron-Sized CeO2 and Its Polishing Performance
Xingzi Wang,
Ning Wang,
Zhenyu Zhang
et al.
Abstract:CeO2 is widely used in the field of chemical–mechanical polishing for integrated circuits. Morphology, particle size, crystallinity, and Ce3+ concentration are crucial factors that affect polishing performance. In this study, we successfully synthesized two novel triangular CeO2 abrasives with similar particle sizes (600 nm) but different morphologies and Ce3+ concentrations using a microwave-assisted hydrothermal method with high-concentration raw materials, and no surfactants or template agents were added. I… Show more
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