2018
DOI: 10.1186/s11671-018-2586-2
|View full text |Cite
|
Sign up to set email alerts
|

Controllable Fabrication of Non-Close-Packed Colloidal Nanoparticle Arrays by Ion Beam Etching

Abstract: Polystyrene (PS) nanoparticle films with non-close-packed arrays were prepared by using ion beam etching technology. The effects of etching time, beam current, and voltage on the size reduction of PS particles were well investigated. A slow etching rate, about 9.2 nm/min, is obtained for the nanospheres with the diameter of 100 nm. The rate does not maintain constant with increasing the etching time. This may result from the thermal energy accumulated gradually in a long-time bombardment of ion beam. The etchi… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1
1

Citation Types

0
8
0

Year Published

2019
2019
2023
2023

Publication Types

Select...
6
1

Relationship

3
4

Authors

Journals

citations
Cited by 7 publications
(8 citation statements)
references
References 29 publications
0
8
0
Order By: Relevance
“…Size control of shrunk particles in a tightly packed periodic PS array is important to create mesh structures and extend the application of NSL. To this end, RIE, [ 97,98 ] ion beam etching (IBE), [ 99 ] plasma etching (PE), [ 21,85,97,100,101 ] and inductively coupled plasma etching (ICPE) [ 102,103 ] can be used. Different gases including O 2 , [ 85,104,105 ] Ar, [ 85 ] O 2 /Ar, [ 21 ] or CF 4 /O 2 [ 106 ] are applicable for the plasma etching processes, resulting in varied etching speeds and particle surface roughness.…”
Section: Nanosphere Lithography Technique For Transparent Conductive ...mentioning
confidence: 99%
See 1 more Smart Citation
“…Size control of shrunk particles in a tightly packed periodic PS array is important to create mesh structures and extend the application of NSL. To this end, RIE, [ 97,98 ] ion beam etching (IBE), [ 99 ] plasma etching (PE), [ 21,85,97,100,101 ] and inductively coupled plasma etching (ICPE) [ 102,103 ] can be used. Different gases including O 2 , [ 85,104,105 ] Ar, [ 85 ] O 2 /Ar, [ 21 ] or CF 4 /O 2 [ 106 ] are applicable for the plasma etching processes, resulting in varied etching speeds and particle surface roughness.…”
Section: Nanosphere Lithography Technique For Transparent Conductive ...mentioning
confidence: 99%
“…Mask Modification: Size control of shrunk particles in a tightly packed periodic PS array is important to create mesh structures and extend the application of NSL. To this end, RIE, [97,98] ion beam etching (IBE), [99] plasma etching (PE), [21,85,97,100,101] and inductively coupled plasma etching (ICPE) [102,103] can be used.…”
Section: (5 Of 26)mentioning
confidence: 99%
“…As reported in a previous study of ion-beam etching parameters, the morphology of the etched sample mainly depends on the ion-beam incident angle and the beam current. 38 We use the same conditions and different etching times to etch silver films with different thicknesses. The base side of the triangle decreases from 300 nm to 0 nm, but the height remains the same when the silver film thickness increases from 60 nm to 90 nm, even to 120 nm and 150 nm.…”
Section: Resultsmentioning
confidence: 99%
“…The methods of this kind of synthesis include self assembly ( Zhang et al, 2019b ; Deng et al, 2020 ), laser pyrolysis ( Laurent et al, 2010 ; Dumitrache et al, 2019 ), condensation ( Sano et al, 2020 ), CVD ( Gutés et al, 2012 ; Tyurikova et al, 2020 ), sol-gel method ( Gonçalves, 2018 ), soft lithography ( Fu et al, 2018 ), hydrothermal methods ( Zhen et al, 2019 ; Moreira et al, 2020 ), microwave methods ( Henam et al, 2019 ), sonochemical ( Gupta and Srivastava, 2019 ; Moreira et al, 2020 ), synthesis using plant extracts ( Ogunyemi et al, 2019 ; Ranoszek-Soliwoda et al, 2019 ), and green synthesis ( Gour and Jain, 2019 ; Irshad et al, 2020 ). On the other hand, macroscopic level materials can be trimmed down to NPs by different methods, including mechanical grinding ( Sviridov et al, 2017 ; Haque et al, 2018 ), ball milling ( Li Y. et al, 2020 ), lithography ( Fu et al, 2018 ), vapor deposition ( Choi et al, 2018 ), arc-plasma deposition ( Ito et al, 2012 ; Takahashi et al, 2015 ), ion beam technique ( Heo and Gwag, 2014 ; Yang J. et al, 2018 ), severe plastic deformation ( Cui et al, 2018 ; Sarkari Khorrami et al, 2019 ), chemical etching ( Wareing et al, 2017 ; Pinna et al, 2020 ), sputtering ( Pišlová et al, 2020 ), and laser ablation ( Pandey et al, 2014 ; Abid et al, 2020 ).…”
Section: Classification Of Nanomaterialsmentioning
confidence: 99%