“…Most metals generally have a skin depth of the micrometer order, so the direct heating tends to remain superficial, but using powders with particle size of the skin depth order, it is possible to heat them directly and use microwave in the sintering process. However, the direct heating itself is not capable of explaining the high heating rates and enhanced densification reported in literature, and concurrent phenomena, like arcing and plasma formation are thought to occur (Minay et al, 2004;Roy and Agrawal, 2007).…”
Section: Microwave-green Parts Interactionmentioning
“…Most metals generally have a skin depth of the micrometer order, so the direct heating tends to remain superficial, but using powders with particle size of the skin depth order, it is possible to heat them directly and use microwave in the sintering process. However, the direct heating itself is not capable of explaining the high heating rates and enhanced densification reported in literature, and concurrent phenomena, like arcing and plasma formation are thought to occur (Minay et al, 2004;Roy and Agrawal, 2007).…”
Section: Microwave-green Parts Interactionmentioning
“…Moreover, previous studies demonstrated that the presence of small conductive particles in a dielectric matrix leads to the electric field concentration in the space between the particles, 19 resulting in enhanced neck formation during sintering, 20 or the localized overheating of the dielectric matrix itself 21 . Moreover, when the electric field concentration becomes high enough, breakdown phenomena (plasma formation and arcing) are generated depending on the dielectric strength of the medium interposed between the conductive particles, and this phenomena can trigger more efficient mass transport mechanisms during sintering 22 …”
This study investigated a microwave‐assisted processing route for the synthesis of conductive thick films on dielectric substrates starting from silver (Ag) and a glass frit powder mixture paste. A single mode microwave (2.45 GHz) applicator was used to reduce the processing time and improve the energy efficiency compared with conventional heating. The microstructures of the Ag‐based conductive thick films that were fired using conventional and microwave heating were observed. After 300 s of microwave treatment, the shrinkage of the microwave‐fired Ag conductive thick films was similar to the conventionally processed films at 580°C for 30 min. The results suggested that the drastic reduction of the substrate temperature and the rapid processing time were significant advantages because both helped to minimize the Ag diffusion into the glass, thus reducing the unwanted yellowing phenomena.
“…TiO 2 ) and fibres . The foaming may be related to the nature of the reinforcement, operating with metal fibres (Hastelloy X fibres) mixed with borosilicate glass, under microwave radiation. The fibres tips act as ‘nucleating agents’ for pores, since the higher local electric field strength in their vicinity, connected with their pronounced radius of curvature, enhances the power dissipation in the surrounding glass matrix, which overheats, releasing gasses.…”
Section: Overview Of Glass‐based Productsmentioning
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