2020
DOI: 10.1088/1757-899x/1008/1/012057
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Contribution of structural parameters to the strength and electrical conductivity of Cu-0.5%Cr alloy subjected to ECAP and cold rolling

Abstract: The effect of cold rolling with a reduction rate of 95% at room temperature and subsequent aging on the evolution of the microstructure, strength properties and electrical conductivity of the Cu-0.5Cr alloy (wt.%), which is widely used in the electrical industry in the form of strips and ribbons, has been studied. The cold rolling and aging of the alloy was carried out in coarse-grained and ultrafine-grained states after equal-channel angular pressing. The regularities found were used to assess the contributio… Show more

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Cited by 2 publications
(5 citation statements)
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“…These values are reasonable when compared to pure and alloyed Cu after two‐step plastic deformation processes at room temperature, such as 0.57 × 10 14 m −2 of pure Cu after ECAP + HPT [ 53 ] and 2.19 × 10 14 m −2 of Cu–0.5% Cr after ECAP + cold rolling. [ 67 ] The processes at cryogenic temperature can prohibit the dislocation motions for recrystallization, thereby maintaining high dislocation density, such as ≈1.8 × 10 15 m −2 of pure Cu after ECAP + cryo rolling [ 68 ] and ≈4.0 × 10 15 m −2 of Cu–Cr–Zn after ECAP + cryo rolling. [ 69 ] These reports can support the assertion that the present microstructural changes in the Cu sheets include recrystallization.…”
Section: Resultsmentioning
confidence: 99%
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“…These values are reasonable when compared to pure and alloyed Cu after two‐step plastic deformation processes at room temperature, such as 0.57 × 10 14 m −2 of pure Cu after ECAP + HPT [ 53 ] and 2.19 × 10 14 m −2 of Cu–0.5% Cr after ECAP + cold rolling. [ 67 ] The processes at cryogenic temperature can prohibit the dislocation motions for recrystallization, thereby maintaining high dislocation density, such as ≈1.8 × 10 15 m −2 of pure Cu after ECAP + cryo rolling [ 68 ] and ≈4.0 × 10 15 m −2 of Cu–Cr–Zn after ECAP + cryo rolling. [ 69 ] These reports can support the assertion that the present microstructural changes in the Cu sheets include recrystallization.…”
Section: Resultsmentioning
confidence: 99%
“…For comparison purposes, representative studies on Cu and its alloys processed by these SPD techniques are summarized and compared with the present work. Table 4 shows the summary of the continuous [ 10,54–56,99–111 ] and multiple‐step SPD techniques [ 11,53,57,67–69,71,73,112–124 ] on pure Cu and alloys with the processing condition, imposed strain, final grain size d, achieved hardness value, yield strength σy$\left(\sigma\right)_{y}$, ultimate tensile strength σUTS$\left(\sigma\right)_{\text{UTS}}$, elongation δ , tensile strain rates trueε. $\overset{. }{\epsilon} \textrm{ }$applied for acquiring the mechanical properties, and references.…”
Section: Discussionmentioning
confidence: 99%
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